The Microcircuit,memory, cataloged under National Stock Number 5962-01-163-4168, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is The Boeing Company Div Legacy Boeing Hb1. Government technical data includes 16 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 12 commercial cross-references from 10 manufacturers, enabling identification through both NSN and commercial part number lookups. 12 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-163-4168 |
| Primary Part Number | 000-8002-348 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | The Boeing Company Div Legacy Boeing Hb1 |
| Status | ACTIVE |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Body Length | 0.880 INCHES MINIMUM AND 0.930 INCHES MAXIMUM IN |
| Operating Temp Range | +0.0 TO 75.0 CELSIUS DEGC |
| Memory Capacity | UNKNOWN |
| Voltage Rating and Type Per Characteristic | 5.5 VOLTS MAXIMUM POWER SOURCE |
| Terminal Surface Treatment | SOLDER |
| Time Rating Per Chacteristic | 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Memory Device Type | ROM |
| Terminal Type and Quantity | 18 PRINTED CIRCUIT |
| Inclosure Configuration | DUAL-IN-LINE |
| Features Provided | HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC |
| Body Height | 0.155 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN |
| Input Circuit Pattern | 12 INPUT |
| Body Width | 0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Inclosure Material | CERAMIC AND GLASS |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| 000-8002-348 | The Boeing Company Div Legacy Boeing Hb1 (USA) |
| 4014312-01 | Cae Usa Inc. (USA) |
| MM6353-1J | Mmi/amd (USA) |
| SK010296 | Raytheon Technical Services Company (USA) |
| SN74S476J | Texas Instruments Incorporated (USA) |
| N82S137F | Philips Semiconductors Inc (USA) |
| ROM/PROM | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| 4014312-01 | Raytheon Technical Services Company (USA) |
| HM1-7643-5 | Renesas Electronics America Inc (USA) |
| 4014726-124 | Raytheon Technical Services Company (USA) |
| D3625-2 | Intel Corp Sales Office (USA) |
| 93453DC | Fairchild Semiconductor Corp (USA) |
NSN 5962-01-163-4168 is a Microcircuit,memory, manufactured by The Boeing Company Div Legacy Boeing Hb1, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-163-4168 has 12 cross-referenced part numbers: 000-8002-348 (The Boeing Company Div Legacy Boeing Hb1), 4014312-01 (Cae Usa Inc.), MM6353-1J (Mmi/amd), SK010296 (Raytheon Technical Services Company), SN74S476J (Texas Instruments Incorporated) and 7 more.
There are 12 known substitutes for 5962-01-163-4168: 5962-01-079-5954, 5962-01-083-5164, 5962-01-115-8793 and 9 more. Verify interchangeability with system specifications before substitution.
Key specifications for 000-8002-348: Output Logic Form: TRANSISTOR-TRANSISTOR LOGIC; Body Length: 0.880 INCHES MINIMUM AND 0.930 INCHES MAXIMUM IN; Operating Temp Range: +0.0 TO 75.0 CELSIUS DEGC; Memory Capacity: UNKNOWN. 16 total characteristics are documented in the Federal Logistics Information System.