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Technical Data Sheet
N82S137F ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, body_height: 0.155 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN, body_length: 0.880 INCHES MINIMUM AND 0.930 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, special_features: ELECTROSTATIC SENSITIVE, features_provided: HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-079-5954, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
N82S137F
NSN: 5962-01-079-5954
FSC: 5962
CAGE: 18324 — PHILIPS SEMICONDUCTORS INC (USA)
SPECIFICATIONS
body_width0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
body_height0.155 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN
body_length0.880 INCHES MINIMUM AND 0.930 INCHES MAXIMUM IN
memory_capacityUNKNOWN
special_featuresELECTROSTATIC SENSITIVE
features_providedHERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC AND GLASS
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range+0.0 TO 75.0 CELSIUS DEGC
input_circuit_pattern12 INPUT
NSN5962-01-079-5954
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN N82S137F MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
BODY HEIGHT: 0.175 INCHES MAXIMUM IN
BODY LENGTH: 0.930 INCHES MAXIMUM IN
FEATURES PROVIDED: HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR AND W/ENABLE
OPERATING TEMP RANGE: +0.0 TO 75.0 CELSIUS DEGC
MEMORY CAPACITY: UNKNOWN
TERMINAL TYPE AND QUANTITY: 18 PRINTED CIRCUIT
TIME RATING PER CHACTERISTIC: 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
MEMORY DEVICE TYPE: ROM
TECHNICAL CHARACTERISTICS (FLIS)
BODY HEIGHT0.175 INCHES MAXIMUM IN
BODY LENGTH0.930 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR AND W/ENABLE
OPERATING TEMP RANGE+0.0 TO 75.0 CELSIUS DEGC
MEMORY CAPACITYUNKNOWN
TERMINAL TYPE AND QUANTITY18 PRINTED CIRCUIT
TIME RATING PER CHACTERISTIC60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
MEMORY DEVICE TYPEROM
TERMINAL SURFACE TREATMENTSOLDER
CRITICALITY CODE JUSTIFICATIONFEAT
VERIFIED SUBSTITUTES & CROSS-REFERENCES 18
N82S137FInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROMInterchangeable
interchangeable cross-reference
interchangeable
807802-055A41Interchangeable
interchangeable cross-reference
interchangeable
A574-1Interchangeable
interchangeable cross-reference
interchangeable
HM1-7643-5Interchangeable
interchangeable cross-reference
interchangeable
A574-3Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is N82S137F?
N82S137F is a MICROCIRCUIT,DIGITAL.
What parts can replace N82S137F?
There are 18 known substitutes for N82S137F: N82S137F, ROM/PROM, 807802-055A41 and 15 more. Substitute compatibility should be verified for your specific system.
What is the NSN for N82S137F?
N82S137F is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-079-5954. This indicates validated use in U.S. government and defense supply chains.
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