The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.175 INCHES MAXIMUM IN, body_length: 0.960 INCHES MAXIMUM IN, bit_quantity: 4096, word_quantity: 1024, memory_capacity: UNKNOWN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-079-5954, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.175 INCHES MAXIMUM IN |
| body_length | 0.960 INCHES MAXIMUM IN |
| bit_quantity | 4096 |
| word_quantity | 1024 |
| memory_capacity | UNKNOWN |
| special_features | ELECTROSTATIC SENSITIVE |
| features_provided | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND MONOLITHIC AND W/ENABLE AND 3-STATE OUTPUT |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| NSN | 5962-01-079-5954 |
| BODY HEIGHT | 0.175 INCHES MAXIMUM IN |
| BODY LENGTH | 0.930 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR AND W/ENABLE |
| OPERATING TEMP RANGE | +0.0 TO 75.0 CELSIUS DEGC |
| MEMORY CAPACITY | UNKNOWN |
| TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |
| TIME RATING PER CHACTERISTIC | 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| MEMORY DEVICE TYPE | ROM |
| TERMINAL SURFACE TREATMENT | SOLDER |
| CRITICALITY CODE JUSTIFICATION | FEAT |