Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: 000-8002-348

000-8002-348 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, body_height: 0.155 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN, body_length: 0.880 INCHES MINIMUM AND 0.930 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-163-4168, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

000-8002-348

NSN: 5962-01-163-4168
FSC: 5962
CAGE: 94756 — THE BOEING COMPANY DIV LEGACY BOEING HB1 (USA)

SPECIFICATIONS

body_width	0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
body_height	0.155 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN
body_length	0.880 INCHES MINIMUM AND 0.930 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 75.0 CELSIUS DEGC
input_circuit_pattern	12 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-163-4168

COMPONENT DIAGRAM

KEY FEATURES

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OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC

•

BODY LENGTH: 0.880 INCHES MINIMUM AND 0.930 INCHES MAXIMUM IN

•

OPERATING TEMP RANGE: +0.0 TO 75.0 CELSIUS DEGC

•

MEMORY CAPACITY: UNKNOWN

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VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS MAXIMUM POWER SOURCE

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TERMINAL SURFACE TREATMENT: SOLDER

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TIME RATING PER CHACTERISTIC: 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
BODY LENGTH	0.880 INCHES MINIMUM AND 0.930 INCHES MAXIMUM IN
OPERATING TEMP RANGE	+0.0 TO 75.0 CELSIUS DEGC
MEMORY CAPACITY	UNKNOWN
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	5.5 VOLTS MAXIMUM POWER SOURCE
TERMINAL SURFACE TREATMENT	SOLDER
TIME RATING PER CHACTERISTIC	30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
MEMORY DEVICE TYPE	ROM
TERMINAL TYPE AND QUANTITY	18 PRINTED CIRCUIT
INCLOSURE CONFIGURATION	DUAL-IN-LINE

VERIFIED SUBSTITUTES & CROSS-REFERENCES 22

4014312-01Interchangeable