The Microcircuit,memory, cataloged under National Stock Number 5962-01-081-9132, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Lockheed Martin Corporation Div Lockheed Martin Aeronautics Company. Government technical data includes 17 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 24 commercial cross-references from 18 manufacturers, enabling identification through both NSN and commercial part number lookups. 12 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-081-9132 |
| Primary Part Number | C8278-1 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Lockheed Martin Corporation Div Lockheed Martin Aeronautics Company |
| Status | ACTIVE |
| Storage Temp Range | -65.0 TO 125.0 CELSIUS DEGC |
| Body Width | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN |
| Terminal Surface Treatment | SOLDER |
| Time Rating Per Chacteristic | 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS |
| Memory Device Type | ROM |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Voltage Rating and Type Per Characteristic | 26.5 VOLTS MAXIMUM POWER SOURCE |
| Memory Capacity | UNKNOWN |
| Terminal Type and Quantity | 24 PRINTED CIRCUIT |
| Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| Inclosure Configuration | DUAL-IN-LINE |
| Body Length | 1.290 INCHES MAXIMUM IN |
| Body Height | 0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Features Provided | MONOLITHIC AND POSITIVE OUTPUTS AND HERMETICALLY SEALED AND W/ENABLE AND W/DECODED OUTPUT AND PROGRAMMABLE AND PROGRAMMED AND W/BUFFERED OUTPUT AND 3-STATE OUTPUT |
| Inclosure Material | CERAMIC AND GLASS |
| Input Circuit Pattern | 11 INPUT |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| F2716DLQB | Fairchild Semiconductor Corp (USA) |
| MM2716QM/883B | National Semiconductor Corporation (USA) |
| H990762-001B | Raytheon Company Dba Raytheon (USA) |
| MD2716/B | Intel Corp Sales Office (USA) |
| MB2716/B | Intel Corp Sales Office (USA) |
| 438251-01 | Bae Systems Controls Inc (USA) |
| MD2716M/B | Intel Corp Sales Office (USA) |
| AM2716DLB883B | Advanced Micro Devices Inc Dba AMD Austin (USA) |
| 115372-0003 | Thales Usa, Inc. Div Air Mobility Solutions ("ams") (USA) |
| ZD2608/1 | Saab Aktiebolag (SWE) |
| 4038935-416 | Honeywell International Inc. Dba Honeywell International (USA) |
| 4051272-0701 | Raytheon Company Dba Raytheon Co (USA) |
| GM820AUF1RN | Northrop Grumman Systems Corporation (USA) |
| ZD2608/1 | Saab Ab (publ) - Business Area Surveillance - Ew Systems (SWE) |
| MPM10039J | Texas Instruments Incorporated (USA) |
| ZD2600/1 | Saab Ab (publ) - Business Area Surveillance - Ew Systems (SWE) |
| AM2716DMB | Advanced Micro Devices Inc Dba AMD Austin (USA) |
| AM2716-450/BJA | Advanced Micro Devices Inc Dba AMD Austin (USA) |
| C8278-1 PRIMARY | Lockheed Martin Corporation Div Lockheed Martin Aeronautics Company (USA) |
| 163386-02 | Ge Aviation Systems Llc (USA) |
NSN 5962-01-081-9132 is a Microcircuit,memory, manufactured by Lockheed Martin Corporation Div Lockheed Martin Aeronautics Company, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-081-9132 has 24 cross-referenced part numbers: F2716DLQB (Fairchild Semiconductor Corp), MM2716QM/883B (National Semiconductor Corporation), H990762-001B (Raytheon Company Dba Raytheon), MD2716/B (Intel Corp Sales Office), MB2716/B (Intel Corp Sales Office) and 19 more.
There are 12 known substitutes for 5962-01-081-9132: 5962-01-095-8598, 5962-01-107-1082, 5962-01-151-1328 and 9 more. Verify interchangeability with system specifications before substitution.
Key specifications for C8278-1: Storage Temp Range: -65.0 TO 125.0 CELSIUS DEGC; Body Width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN; Terminal Surface Treatment: SOLDER; Time Rating Per Chacteristic: 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS. 17 total characteristics are documented in the Federal Logistics Information System.