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F2716DLQB — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

F2716DLQB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-081-9132, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
F2716DLQB
NSN: 5962-01-081-9132
FSC: 5962 — Microcircuits, Electronic
CAGE: 07263 — FAIRCHILD SEMICONDUCTOR CORP (USA)
SPECIFICATIONS
body_width0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN
body_length1.290 INCHES MAXIMUM IN
memory_capacityUNKNOWN
features_providedMONOLITHIC AND POSITIVE OUTPUTS AND HERMETICALLY SEALED AND W/ENABLE AND W/DECODED OUTPUT AND PROGRAMMABLE AND PROGRAMMED AND W/BUFFERED OUTPUT AND 3-STATE OUTPUT
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC AND GLASS
memory_device_typeROM
storage_temp_range-65.0 TO 125.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern11 INPUT
NSN5962-01-081-9132
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN F2716DLQB MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 11 INPUT
•
INCLOSURE MATERIAL: CERAMIC AND GLASS
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN
•
FEATURES PROVIDED: MONOLITHIC AND POSITIVE OUTPUTS AND HERMETICALLY SEALED AND W/ENABLE AND W/DECODED OUTPUT AND PROGRAMMABLE AND PROGRAMMED AND W/BUFFERED OUTPUT AND 3-STATE OUTPUT
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: ROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN11 INPUT
INCLOSURE MATERIALCERAMIC AND GLASS
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
BODY HEIGHT0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN
FEATURES PROVIDEDMONOLITHIC AND POSITIVE OUTPUTS AND HERMETICALLY SEALED AND W/ENABLE AND W/DECODED OUTPUT AND PROGRAMMABLE AND PROGRAMMED AND W/BUFFERED OUTPUT AND 3-STATE OUTPUT
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEROM
BODY LENGTH1.290 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 125.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 9
MM2716QM/883BSame NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
H990762-001BSame NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
MD2716/BReference document
Same NSN cross-reference
Reference document — Secondary reference
MB2716/BReference document
Same NSN cross-reference
Reference document — Secondary reference
438251-01Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
MD2716M/BReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Demilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is F2716DLQB?
F2716DLQB is a MICROCIRCUIT,MEMORY.
What parts can replace F2716DLQB?
There are 9 known substitutes for F2716DLQB: MM2716QM/883B, H990762-001B, MD2716/B and 6 more. Substitute compatibility should be verified for your specific system.
What is the NSN for F2716DLQB?
F2716DLQB is cataloged in the U.S. Government catalog under NSN 5962-01-081-9132. This indicates validated use in U.S. government and defense supply chains.
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