The Microcircuit,memory, cataloged under National Stock Number 5962-01-227-8296, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Honeywell International Inc. Dba Honeywell International Div Aerospace-Minneapolis. Government technical data includes 16 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 6 commercial cross-references from 5 manufacturers, enabling identification through both NSN and commercial part number lookups. 12 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-227-8296 |
| Primary Part Number | 10104520-103 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Honeywell International Inc. Dba Honeywell International Div Aerospace-Minneapolis |
| Status | ACTIVE |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Terminal Surface Treatment | SOLDER |
| Memory Device Type | ROM |
| Time Rating Per Chacteristic | 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Terminal Type and Quantity | 24 PRINTED CIRCUIT |
| Voltage Rating and Type Per Characteristic | 6.0 VOLTS MAXIMUM POWER SOURCE |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Input Circuit Pattern | 13 INPUT |
| Storage Temp Range | -65.0 TO 125.0 CELSIUS DEGC |
| Operating Temp Range | -55.0 TO 100.0 CELSIUS DEGC |
| Inclosure Configuration | DUAL-IN-LINE |
| Body Height | 0.210 INCHES MAXIMUM IN |
| Inclosure Material | CERAMIC |
| Features Provided | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE |
| Body Width | 0.610 INCHES MAXIMUM IN |
| Body Length | 1.290 INCHES MAXIMUM IN |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| AM2716DMB | Advanced Micro Devices Inc Dba AMD Austin (USA) |
| MD2716/B | Intel Corp Sales Office (USA) |
| ROM/PROM FAMILY 020 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| 10069392-101 | Honeywell International Inc. Dba Honeywell International Div Aerospace-Minneapolis (USA) |
| 10104520-103 PRIMARY | Honeywell International Inc. Dba Honeywell International Div Aerospace-Minneapolis (USA) |
| MCM2716BJXC | Freescale Semiconductor, Inc. (USA) |
NSN 5962-01-227-8296 is a Microcircuit,memory, manufactured by Honeywell International Inc. Dba Honeywell International Div Aerospace-Minneapolis, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-227-8296 has 6 cross-referenced part numbers: AM2716DMB (Advanced Micro Devices Inc Dba AMD Austin), MD2716/B (Intel Corp Sales Office), ROM/PROM FAMILY 020 (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), 10069392-101 (Honeywell International Inc. Dba Honeywell International Div Aerospace-Minneapolis), 10104520-103 (Honeywell International Inc. Dba Honeywell International Div Aerospace-Minneapolis) and 1 more.
There are 12 known substitutes for 5962-01-227-8296: 5962-01-081-9132, 5962-01-227-8294, 5962-01-227-8297 and 9 more. Verify interchangeability with system specifications before substitution.
Key specifications for 10104520-103: Output Logic Form: TRANSISTOR-TRANSISTOR LOGIC; Terminal Surface Treatment: SOLDER; Memory Device Type: ROM; Time Rating Per Chacteristic: 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS. 16 total characteristics are documented in the Federal Logistics Information System.