MM2716QM/883B: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.600 INCHES MAXIMUM IN, body_height: 0.205 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: MONOLITHIC AND PROGRAMMABLE AND ERASABLE, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-081-9132, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.600 INCHES MAXIMUM IN |
| body_height | 0.205 INCHES MAXIMUM IN |
| body_length | 1.290 INCHES MAXIMUM IN |
| memory_capacity | UNKNOWN |
| features_provided | MONOLITHIC AND PROGRAMMABLE AND ERASABLE |
| output_logic_form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 125.0 CELSIUS DEGC |
| operating_temp_range | -40.0 TO 85.0 CELSIUS DEGC |
| input_circuit_pattern | 13 INPUT |
| end_item_identification | AN/UGC-129(V) TELETYPEWRITER SET |
| NSN | 5962-01-081-9132 |
| INPUT CIRCUIT PATTERN | 11 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN |
| FEATURES PROVIDED | MONOLITHIC AND POSITIVE OUTPUTS AND HERMETICALLY SEALED AND W/ENABLE AND W/DECODED OUTPUT AND PROGRAMMABLE AND PROGRAMMED AND W/BUFFERED OUTPUT AND 3-STATE OUTPUT |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MEMORY DEVICE TYPE | ROM |
| BODY LENGTH | 1.290 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 125.0 CELSIUS DEGC |