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ROM/PROM HEAD 189 — Technical Data Sheet

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— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: BIPOLAR AND MONOLITHIC AND BURN IN, MIL-STD-883, CLASS B AND PROGRAMMABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-370-7306, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
ROM/PROM HEAD 189
NSN: 5962-01-370-7306
FSC: 5962
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)
SPECIFICATIONS
body_width0.310 INCHES MAXIMUM IN
body_height0.185 INCHES MAXIMUM IN
body_length1.060 INCHES MAXIMUM IN
features_providedBIPOLAR AND MONOLITHIC AND BURN IN, MIL-STD-883, CLASS B AND PROGRAMMABLE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD 883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern16 INPUT
hybrid_technology_typeMONOLITHIC
NSN5962-01-370-7306
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN ROM/PROM HEAD 189 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
•
BODY HEIGHT: 0.185 INCHES MAXIMUM IN
•
INPUT CIRCUIT PATTERN: 16 INPUT
•
FEATURES PROVIDED: BIPOLAR AND MONOLITHIC AND BURN IN, MIL-STD-883, CLASS B AND PROGRAMMABLE
•
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
BODY HEIGHT0.185 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN16 INPUT
PART NAME ASSIGNED BY CONTROLLING AGENCY16-INPUT 8-OUTPUT REGISTERED AND-OR GATE ARRAY
FEATURES PROVIDEDBIPOLAR AND MONOLITHIC AND BURN IN, MIL-STD-883, CLASS B AND PROGRAMMABLE
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
OUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
INCLOSURE CONFIGURATIONDUAL-IN-LINE
VERIFIED SUBSTITUTES & CROSS-REFERENCES 22
850CInterchangeable
interchangeable cross-reference
interchangeable
0850CInterchangeable
interchangeable cross-reference
interchangeable
850-65Interchangeable
interchangeable cross-reference
interchangeable
8506503RAInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROM HEAD 095Interchangeable
interchangeable cross-reference
interchangeable
8506503RBInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusCANCELLED
Availability—
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is ROM/PROM HEAD 189?
ROM/PROM HEAD 189 is a MICROCIRCUIT,MEMORY.
What parts can replace ROM/PROM HEAD 189?
There are 22 known substitutes for ROM/PROM HEAD 189: 850C, 0850C, 850-65 and 19 more. Substitute compatibility should be verified for your specific system.
Is ROM/PROM HEAD 189 still available?
ROM/PROM HEAD 189 is currently cancelled.
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Last verified: September 2026