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8506503RA ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, overall_height: 0.400 INCHES MAXIMUM IN, overall_length: 1.060 INCHES MAXIMUM IN, features_provided: HIGH IMPEDANCE AND MONOLITHIC AND W/CLOCK AND W/ENABLE AND W/DISABLE AND ELECTROSTATIC SENSITIVE. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-239-2154, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
8506503RA
NSN: 5962-01-239-2154
FSC: 5962
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length1.060 INCHES MAXIMUM IN
overall_height0.400 INCHES MAXIMUM IN
overall_length1.060 INCHES MAXIMUM IN
features_providedHIGH IMPEDANCE AND MONOLITHIC AND W/CLOCK AND W/ENABLE AND W/DISABLE AND ELECTROSTATIC SENSITIVE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
NSN5962-01-239-2154
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 8506503RA MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
MEMORY DEVICE TYPE: PAL
•
TIME RATING PER CHACTERISTIC: 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
•
INPUT CIRCUIT PATTERN: 12 INPUT
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
INCLOSURE MATERIAL: CERAMIC
•
BODY HEIGHT: 0.185 INCHES MAXIMUM IN
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
•
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
MEMORY DEVICE TYPEPAL
TIME RATING PER CHACTERISTIC75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
INPUT CIRCUIT PATTERN12 INPUT
INCLOSURE CONFIGURATIONDUAL-IN-LINE
INCLOSURE MATERIALCERAMIC
BODY HEIGHT0.185 INCHES MAXIMUM IN
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
OUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
BODY LENGTH1.060 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE
VERIFIED SUBSTITUTES & CROSS-REFERENCES 24
850CInterchangeable
interchangeable cross-reference
interchangeable
0850CInterchangeable
interchangeable cross-reference
interchangeable
850-65Interchangeable
interchangeable cross-reference
interchangeable
8506501RAInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROM HEAD 094Interchangeable
interchangeable cross-reference
interchangeable
8506504RBInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 8506503RA?
8506503RA is a MICROCIRCUIT,MEMORY.
What parts can replace 8506503RA?
There are 24 known substitutes for 8506503RA: 850C, 0850C, 850-65 and 21 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 8506503RA?
8506503RA is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-239-2154. This indicates validated use in U.S. government and defense supply chains.
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✓ Validated with multiple authoritative sources, including Government, OEM, and Certified sources.
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Last verified: July 2026