850-65 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

850-65: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, overall_length: 14.910 INCHES NOMINAL IN, mounting_method: TUBULAR, overall_diameter: 1.181 INCHES NOMINAL IN. This part is cataloged in the U.S.

Government catalog under NSN 6610-00-844-9799, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

850-65

NSN: 6610-00-844-9799
NIINs: 008449799, 012392154, 012392155, 012675823, 012790147, 013707306, 014330499
FSC: 6610 — Flight Instruments
CAGE: 04274 — ROSEMOUNT INC DBA FISHER ROSEMOUNT SERVICE AND SUPPORT (USA)

SPECIFICATIONS

body_width	0.310 INCHES MAXIMUM IN
body_height	0.185 INCHES MAXIMUM IN
body_length	1.060 INCHES MAXIMUM IN
overall_length	14.910 INCHES NOMINAL IN
mounting_method	TUBULAR
overall_diameter	1.181 INCHES NOMINAL IN
features_provided	PROGRAMMED
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD 883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
NSN	6610-00-844-9799

COMPONENT DIAGRAM

KEY FEATURES

•

OVERALL DIAMETER: 1.181 INCHES NOMINAL IN

•

MOUNTING METHOD: TUBULAR

•

HEATING ELEMENT VOLTAGE IN VOLTS: 28.0

•

HEATING ELEMENT CURRENT TYPE: AC OR DC

•

HEATING ELEMENT PHASE: SINGLE

•

HEATING ELEMENT FREQUENCY IN HERTZ: 60.0

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

OVERALL DIAMETER	1.181 INCHES NOMINAL IN
MOUNTING METHOD	TUBULAR
OVERALL LENGTH	14.910 INCHES NOMINAL IN
HEATING ELEMENT VOLTAGE IN VOLTS	28.0
HEATING ELEMENT CURRENT TYPE	AC OR DC
HEATING ELEMENT PHASE	SINGLE
HEATING ELEMENT FREQUENCY IN HERTZ	60.0

SUBSTITUTES & CROSS-REFERENCES 2

0850CReference document

Same NSN cross-reference

Reference document — Secondary reference

850CReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 850-65?

850-65 is a MICROCIRCUIT,MEMORY.

What parts can replace 850-65?

There are 2 known substitutes for 850-65: 0850C, 850C. Substitute compatibility should be verified for your specific system.

What is the NSN for 850-65?

850-65 is cataloged in the U.S. Government catalog under NSN 6610-00-844-9799. This indicates validated use in U.S. government and defense supply chains.

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