The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: PROGRAMMABLE AND BIPOLAR AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-267-5823, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.140 INCHES MAXIMUM IN |
| body_length | 1.060 INCHES MAXIMUM IN |
| features_provided | PROGRAMMABLE AND BIPOLAR AND MONOLITHIC |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 16 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| NSN | 5962-01-267-5823 |
| BODY HEIGHT | 0.140 INCHES MAXIMUM IN |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MAXIMUM POWER DISSIPATION RATING | 300.0 MILLIWATTS |
| TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
| MEMORY DEVICE TYPE | PAL |
| CASE OUTLINE SOURCE AND DESIGNATOR | D-8 MIL-M-38510 |
| BODY LENGTH | 1.060 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |