ROM/PROM HEAD 184 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

ROM/PROM HEAD 184: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: PROGRAMMABLE AND BIPOLAR AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-267-5823, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

ROM/PROM HEAD 184

NSN: 5962-01-267-5823
FSC: 5962 — Microcircuits, Electronic
CAGE: 14933 — DEFENSE ELECTRONICS SUPPLY CENTER (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.140 INCHES MAXIMUM IN
body_length	1.060 INCHES MAXIMUM IN
features_provided	PROGRAMMABLE AND BIPOLAR AND MONOLITHIC
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	16 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-267-5823

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 16 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.140 INCHES MAXIMUM IN

•

FEATURES PROVIDED: PROGRAMMABLE AND BIPOLAR AND MONOLITHIC

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PAL

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	16 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.140 INCHES MAXIMUM IN
FEATURES PROVIDED	PROGRAMMABLE AND BIPOLAR AND MONOLITHIC
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PAL
CASE OUTLINE SOURCE AND DESIGNATOR	D-8 MIL-M-38510
BODY LENGTH	1.060 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 5

85065Reference document

Same NSN cross-reference

Reference document — Identification reference

8506504RBReference document

Same NSN cross-reference

Reference document — Secondary reference

8506504RASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

8506504RXReference document

Same NSN cross-reference

Reference document — Secondary reference

PAL16R4A-4MJ883BReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is ROM/PROM HEAD 184?

ROM/PROM HEAD 184 is a MICROCIRCUIT,MEMORY.

What parts can replace ROM/PROM HEAD 184?

There are 5 known substitutes for ROM/PROM HEAD 184: 85065, 8506504RB, 8506504RA and 2 more. Substitute compatibility should be verified for your specific system.

What is the NSN for ROM/PROM HEAD 184?

ROM/PROM HEAD 184 is cataloged in the U.S. Government catalog under NSN 5962-01-267-5823. This indicates validated use in U.S. government and defense supply chains.

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