PAL16R4A-4MJ883B — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

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Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.216 INCHES MINIMUM AND 0.334 INCHES MAXIMUM IN, body_height: 0.078 INCHES MINIMUM AND 0.250 INCHES MAXIMUM IN, body_length: 0.898 INCHES MINIMUM AND 1.200 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-267-5823, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

PAL16R4A-4MJ883B

NSN: 5962-01-267-5823
FSC: 5962
CAGE: 50364 — MMI/AMD (USA)

SPECIFICATIONS

body_width	0.216 INCHES MINIMUM AND 0.334 INCHES MAXIMUM IN
body_height	0.078 INCHES MINIMUM AND 0.250 INCHES MAXIMUM IN
body_length	0.898 INCHES MINIMUM AND 1.200 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND MONOLITHIC
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-267-5823

COMPONENT DIAGRAM

KEY FEATURES

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BODY HEIGHT: 0.140 INCHES MAXIMUM IN

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INCLOSURE CONFIGURATION: DUAL-IN-LINE

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MAXIMUM POWER DISSIPATION RATING: 300.0 MILLIWATTS

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TERMINAL TYPE AND QUANTITY: 20 PRINTED CIRCUIT

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MEMORY DEVICE TYPE: PAL

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CASE OUTLINE SOURCE AND DESIGNATOR: D-8 MIL-M-38510

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BODY LENGTH: 1.060 INCHES MAXIMUM IN

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STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

TECHNICAL CHARACTERISTICS (FLIS)

BODY HEIGHT	0.140 INCHES MAXIMUM IN
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MAXIMUM POWER DISSIPATION RATING	300.0 MILLIWATTS
TERMINAL TYPE AND QUANTITY	20 PRINTED CIRCUIT
MEMORY DEVICE TYPE	PAL
CASE OUTLINE SOURCE AND DESIGNATOR	D-8 MIL-M-38510
BODY LENGTH	1.060 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER

VERIFIED SUBSTITUTES & CROSS-REFERENCES 24

850CInterchangeable