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Technical Data Sheet
85065 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, overall_length: 14.910 INCHES NOMINAL IN, mounting_method: TUBULAR, overall_diameter: 1.181 INCHES NOMINAL IN. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 6610-00-844-9799, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
85065
NSN: 6610-00-844-9799
FSC: 6610
CAGE: 04274 — ROSEMOUNT INC DBA FISHER ROSEMOUNT SERVICE AND SUPPORT (USA)
SPECIFICATIONS
body_width0.310 INCHES MAXIMUM IN
body_height0.185 INCHES MAXIMUM IN
body_length1.060 INCHES MAXIMUM IN
overall_length14.910 INCHES NOMINAL IN
mounting_methodTUBULAR
overall_diameter1.181 INCHES NOMINAL IN
features_providedPROGRAMMED
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD 883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
NSN6610-00-844-9799
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 85065 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
OVERALL DIAMETER: 1.181 INCHES NOMINAL IN
HEATING ELEMENT VOLTAGE IN VOLTS: 28.0
MOUNTING METHOD: TUBULAR
HEATING ELEMENT FREQUENCY IN HERTZ: 60.0
HEATING ELEMENT PHASE: SINGLE
HEATING ELEMENT CURRENT TYPE: AC OR DC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
OVERALL DIAMETER1.181 INCHES NOMINAL IN
HEATING ELEMENT VOLTAGE IN VOLTS28.0
MOUNTING METHODTUBULAR
HEATING ELEMENT FREQUENCY IN HERTZ60.0
HEATING ELEMENT PHASESINGLE
OVERALL LENGTH14.910 INCHES NOMINAL IN
HEATING ELEMENT CURRENT TYPEAC OR DC
VERIFIED SUBSTITUTES & CROSS-REFERENCES 16
8506503RAInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROM HEAD 095Interchangeable
interchangeable cross-reference
interchangeable
8506503RBInterchangeable
interchangeable cross-reference
interchangeable
85065Interchangeable
interchangeable cross-reference
interchangeable
8506501RAInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROM HEAD 094Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99Not HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 85065?
85065 is a MICROCIRCUIT,MEMORY.
What parts can replace 85065?
There are 16 known substitutes for 85065: 8506503RA, ROM/PROM HEAD 095, 8506503RB and 13 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 85065?
85065 is cataloged in the Federal Logistics Information System (FLIS) under NSN 6610-00-844-9799. This indicates validated use in U.S. government and defense supply chains.
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