PAL16R6A-4MJ883B — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

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PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, body_height: 0.155 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN, body_length: 0.955 INCHES MINIMUM AND 0.990 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-239-2154, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

PAL16R6A-4MJ883B

NSN: 5962-01-239-2154
FSC: 5962
CAGE: 34335 — ADVANCED MICRO DEVICES INC DBA AMD AUSTIN (USA)

SPECIFICATIONS

body_width	0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
body_height	0.155 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN
body_length	0.955 INCHES MINIMUM AND 0.990 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-239-2154

COMPONENT DIAGRAM

KEY FEATURES

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MEMORY DEVICE TYPE: PAL

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TIME RATING PER CHACTERISTIC: 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

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INPUT CIRCUIT PATTERN: 12 INPUT

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INCLOSURE CONFIGURATION: DUAL-IN-LINE

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INCLOSURE MATERIAL: CERAMIC

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BODY HEIGHT: 0.185 INCHES MAXIMUM IN

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OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

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OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC

TECHNICAL CHARACTERISTICS (FLIS)

MEMORY DEVICE TYPE	PAL
TIME RATING PER CHACTERISTIC	75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
INPUT CIRCUIT PATTERN	12 INPUT
INCLOSURE CONFIGURATION	DUAL-IN-LINE
INCLOSURE MATERIAL	CERAMIC
BODY HEIGHT	0.185 INCHES MAXIMUM IN
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
BODY LENGTH	1.060 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE

VERIFIED SUBSTITUTES & CROSS-REFERENCES 23

850CInterchangeable