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ROM/PROM HEAD 094 — Technical Data Sheet

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— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-239-2155, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
ROM/PROM HEAD 094
NSN: 5962-01-239-2155
FSC: 5962
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.185 INCHES MAXIMUM IN
body_length1.060 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern16 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-01-239-2155
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN ROM/PROM HEAD 094 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
MEMORY DEVICE TYPE: PAL
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MAXIMUM POWER DISSIPATION RATING: 300.0 MILLIWATTS
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
•
BODY LENGTH: 1.060 INCHES MAXIMUM IN
•
TERMINAL TYPE AND QUANTITY: 20 PRINTED CIRCUIT
•
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
•
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
MEMORY DEVICE TYPEPAL
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MAXIMUM POWER DISSIPATION RATING300.0 MILLIWATTS
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
BODY LENGTH1.060 INCHES MAXIMUM IN
TERMINAL TYPE AND QUANTITY20 PRINTED CIRCUIT
BODY WIDTH0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
OUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
INCLOSURE MATERIALCERAMIC
TIME RATING PER CHACTERISTIC75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
VERIFIED SUBSTITUTES & CROSS-REFERENCES 28
850CInterchangeable
interchangeable cross-reference
interchangeable
0850CInterchangeable
interchangeable cross-reference
interchangeable
850-65Interchangeable
interchangeable cross-reference
interchangeable
16065-002Interchangeable
interchangeable cross-reference
interchangeable
8506503RAInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROM HEAD 095Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is ROM/PROM HEAD 094?
ROM/PROM HEAD 094 is a MICROCIRCUIT,MEMORY.
What parts can replace ROM/PROM HEAD 094?
There are 28 known substitutes for ROM/PROM HEAD 094: 850C, 0850C, 850-65 and 25 more. Substitute compatibility should be verified for your specific system.
What is the NSN for ROM/PROM HEAD 094?
ROM/PROM HEAD 094 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-239-2155. This indicates validated use in U.S. government and defense supply chains.
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Last verified: September 2026