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Technical Data Sheet

PAL16L8A-4MW/883B — Technical Data Sheet

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WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: PROGRAMMED, memory_device_type: PAL, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: FLAT PACK, terminal_type_and_quantity: 20 FLAT LEADS, voltage_rating_and_type_per_characteristic: 5.0 VOLTS NOMINAL POWER SOURCE. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-433-0499, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
PAL16L8A-4MW/883B
NSN: 5962-01-433-0499
FSC: 5962
CAGE: 3V146 — ROCHESTER ELECTRONICS LLC (USA)
SPECIFICATIONS
features_providedPROGRAMMED
memory_device_typePAL
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationFLAT PACK
terminal_type_and_quantity20 FLAT LEADS
voltage_rating_and_type_per_characteristic5.0 VOLTS NOMINAL POWER SOURCE
NSN5962-01-433-0499
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN PAL16L8A-4MW/883B MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE CONFIGURATION: FLAT PACK
•
FEATURES PROVIDED: PROGRAMMED
•
MEMORY DEVICE TYPE: PAL
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.0 VOLTS NOMINAL POWER SOURCE
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
•
TERMINAL TYPE AND QUANTITY: 20 FLAT LEADS
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
INCLOSURE CONFIGURATIONFLAT PACK
FEATURES PROVIDEDPROGRAMMED
MEMORY DEVICE TYPEPAL
VOLTAGE RATING AND TYPE PER CHARACTERISTIC5.0 VOLTS NOMINAL POWER SOURCE
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
TERMINAL TYPE AND QUANTITY20 FLAT LEADS
VERIFIED SUBSTITUTES & CROSS-REFERENCES 16
850CInterchangeable
interchangeable cross-reference
interchangeable
0850CInterchangeable
interchangeable cross-reference
interchangeable
850-65Interchangeable
interchangeable cross-reference
interchangeable
8506503RAInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROM HEAD 095Interchangeable
interchangeable cross-reference
interchangeable
8506503RBInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is PAL16L8A-4MW/883B?
PAL16L8A-4MW/883B is a MICROCIRCUIT,MEMORY.
What parts can replace PAL16L8A-4MW/883B?
There are 16 known substitutes for PAL16L8A-4MW/883B: 850C, 0850C, 850-65 and 13 more. Substitute compatibility should be verified for your specific system.
What is the NSN for PAL16L8A-4MW/883B?
PAL16L8A-4MW/883B is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-433-0499. This indicates validated use in U.S. government and defense supply chains.
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