MD8035HL/B — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

MD8035HL/B: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.205 INCHES NOMINAL IN, body_length: 2.030 INCHES MINIMUM AND 2.080 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND EXPANDABLE AND W/ENABLE, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-117-3730, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

MD8035HL/B

NSN: 5962-01-117-3730
FSC: 5962 — Microcircuits, Electronic
CAGE: 34649 — INTEL CORP SALES OFFICE (USA)

SPECIFICATIONS

body_width	0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
body_height	0.205 INCHES NOMINAL IN
body_length	2.030 INCHES MINIMUM AND 2.080 INCHES MAXIMUM IN
bit_quantity	8
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND EXPANDABLE AND W/ENABLE
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	32 INPUT
end_item_identification	5865-01-004-1098 15942
NSN	5962-01-117-3730

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 8

•

INPUT CIRCUIT PATTERN: 32 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.205 INCHES NOMINAL IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND EXPANDABLE AND W/ENABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	8
INPUT CIRCUIT PATTERN	32 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
BODY HEIGHT	0.205 INCHES NOMINAL IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND EXPANDABLE AND W/ENABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	2.030 INCHES MINIMUM AND 2.080 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 4

MD8035AHL/BReference document

Same NSN cross-reference

Reference document — Design control — primary reference

D8035Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

51034-0003Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

MD8035LReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is MD8035HL/B?

MD8035HL/B is a MICROCIRCUIT,MEMORY.

What parts can replace MD8035HL/B?

There are 4 known substitutes for MD8035HL/B: MD8035AHL/B, D8035, 51034-0003 and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for MD8035HL/B?

MD8035HL/B is cataloged in the U.S. Government catalog under NSN 5962-01-117-3730. This indicates validated use in U.S. government and defense supply chains.

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