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51034-0003 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

51034-0003: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.205 INCHES NOMINAL IN, body_length: 2.030 INCHES MINIMUM AND 2.080 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND EXPANDABLE AND W/ENABLE, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-117-3730, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
51034-0003
NSN: 5962-01-117-3730
FSC: 5962 — Microcircuits, Electronic
CAGE: 27914 — HONEYWELL INTERNATIONAL INC DBA HONEYWELL (USA)
SPECIFICATIONS
body_width0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
body_height0.205 INCHES NOMINAL IN
body_length2.030 INCHES MINIMUM AND 2.080 INCHES MAXIMUM IN
bit_quantity8
features_providedHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND EXPANDABLE AND W/ENABLE
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC AND GLASS
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern32 INPUT
end_item_identification5865-01-004-1098 15942
NSN5962-01-117-3730
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 51034-0003 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
BIT QUANTITY: 8
•
INPUT CIRCUIT PATTERN: 32 INPUT
•
INCLOSURE MATERIAL: CERAMIC AND GLASS
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.205 INCHES NOMINAL IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND EXPANDABLE AND W/ENABLE
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
BIT QUANTITY8
INPUT CIRCUIT PATTERN32 INPUT
INCLOSURE MATERIALCERAMIC AND GLASS
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
BODY HEIGHT0.205 INCHES NOMINAL IN
FEATURES PROVIDEDHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND EXPANDABLE AND W/ENABLE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEROM
BODY LENGTH2.030 INCHES MINIMUM AND 2.080 INCHES MAXIMUM IN
SUBSTITUTES & CROSS-REFERENCES 4
MD8035AHL/BReference document
Same NSN cross-reference
Reference document — Design control — primary reference
D8035Reference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
MD8035HL/BReference document
Same NSN cross-reference
Reference document — Secondary reference
MD8035LReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 51034-0003?
51034-0003 is a MICROCIRCUIT,MEMORY.
What parts can replace 51034-0003?
There are 4 known substitutes for 51034-0003: MD8035AHL/B, D8035, MD8035HL/B and 1 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 51034-0003?
51034-0003 is cataloged in the U.S. Government catalog under NSN 5962-01-117-3730. This indicates validated use in U.S. government and defense supply chains.
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