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D8035 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

D8035: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include material: GLASS BOROSILICATE, body_width: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.205 INCHES NOMINAL IN, body_length: 2.030 INCHES MINIMUM AND 2.080 INCHES MAXIMUM IN, bore_diameter: 1.850 INCHES NOMINAL IN, overall_length: 23.013 INCHES NOMINAL IN. This part is cataloged in the U.S.

Government catalog under NSN 9340-00-820-7367, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
D8035
NSN: 9340-00-820-7367
NIINs: 008207367, 011173730
FSC: 9340 — Glass Fabricated Materials
CAGE: 39739 — SCOTT FETZER COMPANY, THE DBA MERIAM PROCESS TECHNOLOGIES DIV MERIAM INSTRUMENT (USA)
SPECIFICATIONS
materialGLASS BOROSILICATE
body_width0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
body_height0.205 INCHES NOMINAL IN
body_length2.030 INCHES MINIMUM AND 2.080 INCHES MAXIMUM IN
bit_quantity8
bore_diameter1.850 INCHES NOMINAL IN
overall_length23.013 INCHES NOMINAL IN
wall_thickness0.079 INCHES NOMINAL IN
overall_diameter2.0008 INCHES NOMINAL IN
style_designatorTUBING
features_providedHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND EXPANDABLE AND W/ENABLE
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
NSN9340-00-820-7367
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN D8035 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
OVERALL DIAMETER: 2.0008 INCHES NOMINAL IN
•
STYLE DESIGNATOR: TUBING
•
WALL THICKNESS: 0.079 INCHES NOMINAL IN
•
BORE DIAMETER: 1.850 INCHES NOMINAL IN
•
MATERIAL: GLASS BOROSILICATE
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
OVERALL DIAMETER2.0008 INCHES NOMINAL IN
STYLE DESIGNATORTUBING
OVERALL LENGTH23.013 INCHES NOMINAL IN
WALL THICKNESS0.079 INCHES NOMINAL IN
BORE DIAMETER1.850 INCHES NOMINAL IN
MATERIALGLASS BOROSILICATE
SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE
NSN statusActive· U.S. Government catalog
No demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is D8035?
D8035 is a MICROCIRCUIT,MEMORY.
What is the NSN for D8035?
D8035 is cataloged in the U.S. Government catalog under NSN 9340-00-820-7367. This indicates validated use in U.S. government and defense supply chains.
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✓ PartsTable — the parts reference. Every fact cited to its source.
PartsTable Design LLC · partstable.com
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.
PartsTable commercial catalog: edition Unified commercial catalog snapshot through 2026-09-28, edition date not on file, retrieved 2026-09-28.