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Technical Data Sheet
A574-1 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.295 INCHES MAXIMUM IN, body_height: 0.200 INCHES MAXIMUM IN, body_length: 0.850 INCHES MINIMUM AND 0.930 INCHES MAXIMUM IN, bit_quantity: 4096, word_quantity: 1024, features_provided: 3-STATE OUTPUT AND PROGRAMMED AND HERMETICALLY SEALED. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-115-8793, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
A574-1
NSN: 5962-01-115-8793
FSC: 5962
CAGE: 36378 — RAYTHEON TECHNICAL SERVICES COMPANY (USA)
SPECIFICATIONS
body_width0.240 INCHES MINIMUM AND 0.295 INCHES MAXIMUM IN
body_height0.200 INCHES MAXIMUM IN
body_length0.850 INCHES MINIMUM AND 0.930 INCHES MAXIMUM IN
bit_quantity4096
word_quantity1024
features_provided3-STATE OUTPUT AND PROGRAMMED AND HERMETICALLY SEALED
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
operating_temp_range+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern12 INPUT
end_item_identification5120-00-089-3660;P/N A57QB
NSN5962-01-115-8793
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN A574-1 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
BIT QUANTITY: 4096
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
FEATURES PROVIDED: 3-STATE OUTPUT AND PROGRAMMED AND HERMETICALLY SEALED
MEMORY DEVICE TYPE: ROM
BODY WIDTH: 0.240 INCHES MINIMUM AND 0.295 INCHES MAXIMUM IN
OPERATING TEMP RANGE: +0.0 TO 70.0 CELSIUS DEGC
WORD QUANTITY: 1024
INCLOSURE CONFIGURATION: DUAL-IN-LINE
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
BIT QUANTITY4096
OUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
FEATURES PROVIDED3-STATE OUTPUT AND PROGRAMMED AND HERMETICALLY SEALED
MEMORY DEVICE TYPEROM
BODY WIDTH0.240 INCHES MINIMUM AND 0.295 INCHES MAXIMUM IN
OPERATING TEMP RANGE+0.0 TO 70.0 CELSIUS DEGC
WORD QUANTITY1024
INCLOSURE CONFIGURATIONDUAL-IN-LINE
TERMINAL SURFACE TREATMENTSOLDER
TERMINAL TYPE AND QUANTITY18 PRINTED CIRCUIT
VERIFIED SUBSTITUTES & CROSS-REFERENCES 11
4014312-01Interchangeable
interchangeable cross-reference
interchangeable
4014312-13Interchangeable
interchangeable cross-reference
interchangeable
93453DCInterchangeable
interchangeable cross-reference
interchangeable
A574-3Interchangeable
interchangeable cross-reference
interchangeable
HM1-7643-5Interchangeable
interchangeable cross-reference
interchangeable
A574-2Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is A574-1?
A574-1 is a MICROCIRCUIT,MEMORY.
What parts can replace A574-1?
There are 11 known substitutes for A574-1: 4014312-01, 4014312-13, 93453DC and 8 more. Substitute compatibility should be verified for your specific system.
What is the NSN for A574-1?
A574-1 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-115-8793. This indicates validated use in U.S. government and defense supply chains.
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