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EDI188512CA20N36B — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

EDI188512CA20N36B: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 11.0 MILLIMETERS NOMINAL MM, body_height: 2.9 MILLIMETERS NOMINAL MM, body_length: 23.0 MILLIMETERS NOMINAL MM, overall_height: 3.8 MILLIMETERS NOMINAL MM, overall_length: 23.5 MILLIMETERS NOMINAL MM, memory_capacity: 512 K X 8. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-520-8127, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
EDI188512CA20N36B
NSN: 5962-01-520-8127
FSC: 5962 — Microcircuits, Electronic
CAGE: 66301 — WHITE ELECTRONIC DESIGNS CORP DIV COMMERCIAL DIVISION (USA)
SPECIFICATIONS
body_width11.0 MILLIMETERS NOMINAL MM
body_height2.9 MILLIMETERS NOMINAL MM
body_length23.0 MILLIMETERS NOMINAL MM
overall_height3.8 MILLIMETERS NOMINAL MM
overall_length23.5 MILLIMETERS NOMINAL MM
memory_capacity512 K X 8
features_providedELECTROSTATIC SENSITIVE AND RADIATION HARDENED
inclosure_materialCERAMIC
memory_device_typeRAM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationLEADED CHIP CARRIER
NSN5962-01-520-8127
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN EDI188512CA20N36B MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 11.0 MILLIMETERS NOMINAL MM
•
BODY HEIGHT: 2.9 MILLIMETERS NOMINAL MM
•
CRITICALITY CODE JUSTIFICATION: CBBL
•
FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND RADIATION HARDENED
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
OVERALL HEIGHT3.8 MILLIMETERS NOMINAL MM
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH11.0 MILLIMETERS NOMINAL MM
BODY HEIGHT2.9 MILLIMETERS NOMINAL MM
CRITICALITY CODE JUSTIFICATIONCBBL
OVERALL LENGTH23.5 MILLIMETERS NOMINAL MM
FEATURES PROVIDEDELECTROSTATIC SENSITIVE AND RADIATION HARDENED
INCLOSURE CONFIGURATIONLEADED CHIP CARRIER
MEMORY DEVICE TYPERAM
SUBSTITUTES & CROSS-REFERENCES 3
205-1033Reference document
Same NSN cross-reference
Reference document — Drawing number reference only
5962-9560004MMAReference document
Same NSN cross-reference
Reference document — Secondary reference
205-1033-020Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation
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FREQUENTLY ASKED QUESTIONS
What is EDI188512CA20N36B?
EDI188512CA20N36B is a MICROCIRCUIT,MEMORY.
What parts can replace EDI188512CA20N36B?
There are 3 known substitutes for EDI188512CA20N36B: 205-1033, 5962-9560004MMA, 205-1033-020. Substitute compatibility should be verified for your specific system.
What is the NSN for EDI188512CA20N36B?
EDI188512CA20N36B is cataloged in the U.S. Government catalog under NSN 5962-01-520-8127. This indicates validated use in U.S. government and defense supply chains.
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