205-1033: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include material: COPPER ALLOY BODY, body_width: 11.0 MILLIMETERS NOMINAL MM, body_height: 2.9 MILLIMETERS NOMINAL MM, body_length: 23.0 MILLIMETERS NOMINAL MM, overall_height: 3.8 MILLIMETERS NOMINAL MM, overall_length: 23.5 MILLIMETERS NOMINAL MM. This part is cataloged in the U.S.
Government catalog under NSN 5999-01-266-5451, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | COPPER ALLOY BODY |
| body_width | 11.0 MILLIMETERS NOMINAL MM |
| body_height | 2.9 MILLIMETERS NOMINAL MM |
| body_length | 23.0 MILLIMETERS NOMINAL MM |
| overall_height | 3.8 MILLIMETERS NOMINAL MM |
| overall_length | 23.5 MILLIMETERS NOMINAL MM |
| memory_capacity | 512 K X 8 |
| mounting_method | PIN(S) |
| style_designator | SOCKET CONTACT |
| features_provided | ELECTROSTATIC SENSITIVE AND RADIATION HARDENED |
| precious_material | GOLD |
| surface_treatment | GOLD BODY |
| NSN | 5999-01-266-5451 |
| PRECIOUS MATERIAL | GOLD |
| MOUNTING METHOD | PIN(S) |
| STYLE DESIGNATOR | SOCKET CONTACT |
| SURFACE TREATMENT | GOLD BODY |
| PRECIOUS MATERIAL AND LOCATION | CONTACT SURFACES GOLD |
| MATERIAL | COPPER ALLOY BODY |
No substitute or cross-reference records for this part.