205-1033-020 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

205-1033-020: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 11.0 MILLIMETERS NOMINAL MM, body_height: 2.9 MILLIMETERS NOMINAL MM, body_length: 23.0 MILLIMETERS NOMINAL MM, overall_height: 3.8 MILLIMETERS NOMINAL MM, overall_length: 23.5 MILLIMETERS NOMINAL MM, memory_capacity: 512 K X 8. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-520-8127, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

205-1033-020

NSN: 5962-01-520-8127
FSC: 5962 — Microcircuits, Electronic
CAGE: 95105 — ROCKWELL COLLINS, INC. DIV COLLINS AEROSPACE - MISSION SYSTEMS (USA)

SPECIFICATIONS

body_width	11.0 MILLIMETERS NOMINAL MM
body_height	2.9 MILLIMETERS NOMINAL MM
body_length	23.0 MILLIMETERS NOMINAL MM
overall_height	3.8 MILLIMETERS NOMINAL MM
overall_length	23.5 MILLIMETERS NOMINAL MM
memory_capacity	512 K X 8
features_provided	ELECTROSTATIC SENSITIVE AND RADIATION HARDENED
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
inclosure_configuration	LEADED CHIP CARRIER
NSN	5962-01-520-8127

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 11.0 MILLIMETERS NOMINAL MM

•

BODY HEIGHT: 2.9 MILLIMETERS NOMINAL MM

•

CRITICALITY CODE JUSTIFICATION: CBBL

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND RADIATION HARDENED

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

OVERALL HEIGHT	3.8 MILLIMETERS NOMINAL MM
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	11.0 MILLIMETERS NOMINAL MM
BODY HEIGHT	2.9 MILLIMETERS NOMINAL MM
CRITICALITY CODE JUSTIFICATION	CBBL
OVERALL LENGTH	23.5 MILLIMETERS NOMINAL MM
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE AND RADIATION HARDENED
INCLOSURE CONFIGURATION	LEADED CHIP CARRIER
MEMORY DEVICE TYPE	RAM

SUBSTITUTES & CROSS-REFERENCES 3

205-1033Reference document

Same NSN cross-reference

Reference document — Drawing number reference only

EDI188512CA20N36BReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-9560004MMAReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation

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FREQUENTLY ASKED QUESTIONS

What is 205-1033-020?

205-1033-020 is a MICROCIRCUIT,MEMORY.

What parts can replace 205-1033-020?

There are 3 known substitutes for 205-1033-020: 205-1033, EDI188512CA20N36B, 5962-9560004MMA. Substitute compatibility should be verified for your specific system.

What is the NSN for 205-1033-020?

205-1033-020 is cataloged in the U.S. Government catalog under NSN 5962-01-520-8127. This indicates validated use in U.S. government and defense supply chains.

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