8506502RB — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: BIPOLAR AND MONOLITHIC AND BURN IN, MIL-STD-883, CLASS B AND PROGRAMMABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-370-7306, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

8506502RB

NSN: 5962-01-370-7306
FSC: 5962
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)

SPECIFICATIONS

body_width	0.310 INCHES MAXIMUM IN
body_height	0.185 INCHES MAXIMUM IN
body_length	1.060 INCHES MAXIMUM IN
features_provided	BIPOLAR AND MONOLITHIC AND BURN IN, MIL-STD-883, CLASS B AND PROGRAMMABLE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD 883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	16 INPUT
hybrid_technology_type	MONOLITHIC
NSN	5962-01-370-7306

COMPONENT DIAGRAM

KEY FEATURES

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OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

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BODY HEIGHT: 0.185 INCHES MAXIMUM IN

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INPUT CIRCUIT PATTERN: 16 INPUT

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FEATURES PROVIDED: BIPOLAR AND MONOLITHIC AND BURN IN, MIL-STD-883, CLASS B AND PROGRAMMABLE

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STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

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INCLOSURE MATERIAL: CERAMIC

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TERMINAL SURFACE TREATMENT: SOLDER

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
BODY HEIGHT	0.185 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN	16 INPUT
PART NAME ASSIGNED BY CONTROLLING AGENCY	16-INPUT 8-OUTPUT REGISTERED AND-OR GATE ARRAY
FEATURES PROVIDED	BIPOLAR AND MONOLITHIC AND BURN IN, MIL-STD-883, CLASS B AND PROGRAMMABLE
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
INCLOSURE CONFIGURATION	DUAL-IN-LINE

VERIFIED SUBSTITUTES & CROSS-REFERENCES 22

850CInterchangeable