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Technical Data Sheet
619126-16 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN, body_length: 0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/DECODED OUTPUT, output_logic_form: CURRENT-MODE LOGIC, inclosure_material: CERAMIC AND GLASS. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-245-3279, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
619126-16
NSN: 5962-00-245-3279
FSC: 5962
CAGE: 34371 — RENESAS ELECTRONICS AMERICA INC (USA)
SPECIFICATIONS
body_width0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
body_height0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN
body_length0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/DECODED OUTPUT
output_logic_formCURRENT-MODE LOGIC
inclosure_materialCERAMIC AND GLASS
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern6 INPUT
inclosure_configurationFLAT PACK
terminal_surface_treatmentSOLDER
terminal_type_and_quantity14 FLAT LEADS
NSN5962-00-245-3279
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN 619126-16 MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
TERMINAL TYPE AND QUANTITY: 14 FLAT LEADS
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/DECODED OUTPUT
INCLOSURE MATERIAL: CERAMIC AND GLASS
OUTPUT LOGIC FORM: CURRENT-MODE LOGIC
MAXIMUM POWER DISSIPATION RATING: 450.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
BODY WIDTH: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
INCLOSURE CONFIGURATION: FLAT PACK
TECHNICAL CHARACTERISTICS (FLIS)
TERMINAL TYPE AND QUANTITY14 FLAT LEADS
FEATURES PROVIDEDHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/DECODED OUTPUT
INCLOSURE MATERIALCERAMIC AND GLASS
OUTPUT LOGIC FORMCURRENT-MODE LOGIC
MAXIMUM POWER DISSIPATION RATING450.0 MILLIWATTS
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
BODY WIDTH0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
INCLOSURE CONFIGURATIONFLAT PACK
DESIGN FUNCTION AND QUANTITY1 DECODER, ONE OF EIGHT LINE
CASE OUTLINE SOURCE AND DESIGNATORT0-86 JOINT ELECTRON DEVICE ENGINEERING COUNCIL
VERIFIED SUBSTITUTES & CROSS-REFERENCES 11
HM9-031-2Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROM FAMILY 057Interchangeable
interchangeable cross-reference
interchangeable
RM9-031-2Interchangeable
interchangeable cross-reference
interchangeable
619126-2Interchangeable
interchangeable cross-reference
interchangeable
619126-3Interchangeable
interchangeable cross-reference
interchangeable
619126-4Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 619126-16?
619126-16 is a MICROCIRCUIT,DIGITAL.
What parts can replace 619126-16?
There are 11 known substitutes for 619126-16: HM9-031-2, ROM/PROM FAMILY 057, RM9-031-2 and 8 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 619126-16?
619126-16 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-245-3279. This indicates validated use in U.S. government and defense supply chains.
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