ROM/PROM FAMILY 057: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.260 INCHES MAXIMUM IN, body_height: 0.045 INCHES NOMINAL IN, body_length: 0.260 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS, output_logic_form: DIODE LOGIC, precious_material: GOLD. This part is cataloged in the U.S.
Government catalog under NSN 5962-00-001-1905, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.260 INCHES MAXIMUM IN |
| body_height | 0.045 INCHES NOMINAL IN |
| body_length | 0.260 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS |
| output_logic_form | DIODE LOGIC |
| precious_material | GOLD |
| inclosure_material | SILICON |
| memory_device_type | DIODE MATRIX |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 6 INPUT |
| inclosure_configuration | FLAT PACK |
| NSN | 5962-00-001-1905 |
| INPUT CIRCUIT PATTERN | 6 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| TERMINAL SURFACE TREATMENT | GOLD |
| PRECIOUS MATERIAL | GOLD |
| BODY WIDTH | 0.260 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC |
| INCLOSURE CONFIGURATION | FLAT PACK |
| MEMORY DEVICE TYPE | DIODE MATRIX |
| BODY LENGTH | 0.260 INCHES MAXIMUM IN |