RM9-031-2 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

RM9-031-2: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.260 INCHES MAXIMUM IN, body_height: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN, body_length: 0.260 INCHES MAXIMUM IN, overall_width: 0.760 INCHES NOMINAL IN, features_provided: MONOLITHIC AND HERMETICALLY SEALED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-00-245-3164, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

RM9-031-2

NSN: 5962-00-245-3164
NIINs: 002453164, 002453267, 002453268, 002453269, 002453270, 002453272, 002453273, 002453275, 002453276, 002453277, 002453278, 002453279, 002453280, 002453281, 002453282, 002453284, 002453285, 002453286, 002453287, 002528425
FSC: 5962 — Microcircuits, Electronic
CAGE: 34371 — RENESAS ELECTRONICS AMERICA INC (USA)

SPECIFICATIONS

body_width	0.260 INCHES MAXIMUM IN
body_height	0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN
body_length	0.260 INCHES MAXIMUM IN
overall_width	0.760 INCHES NOMINAL IN
features_provided	MONOLITHIC AND HERMETICALLY SEALED
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	6 INPUT
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-00-245-3164

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 6 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 1 MATRIX, GENERAL PURPOSE

•

BODY WIDTH: 0.260 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS

•

INCLOSURE CONFIGURATION: FLAT PACK

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	6 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	1 MATRIX, GENERAL PURPOSE
BODY WIDTH	0.260 INCHES MAXIMUM IN
BODY HEIGHT	0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION	FLAT PACK
BODY LENGTH	0.260 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 3

HM9-031-2Reference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROM FAMILY 057Reference document

Same NSN cross-reference

Reference document — Secondary reference

619126-10Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

Ready to buy RM9-031-2?

Compare prices from verified sellers on eBay

Buy on eBay →

As an eBay Partner, PartsTable may earn a commission. Your price is not affected.

FREQUENTLY ASKED QUESTIONS

What is RM9-031-2?

RM9-031-2 is a MICROCIRCUIT,DIGITAL.

What parts can replace RM9-031-2?

There are 3 known substitutes for RM9-031-2: HM9-031-2, ROM/PROM FAMILY 057, 619126-10. Substitute compatibility should be verified for your specific system.

What is the NSN for RM9-031-2?

RM9-031-2 is cataloged in the U.S. Government catalog under NSN 5962-00-245-3164. This indicates validated use in U.S. government and defense supply chains.

Community Feedback

RM9-031-2 — MICROCIRCUIT,DIGITAL

Request a Quote — RM9-031-2