6134896-1 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

6134896-1: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.030 INCHES MAXIMUM IN, body_height: 0.085 INCHES MAXIMUM IN, body_length: 0.625 INCHES MAXIMUM IN, overall_width: 0.965 INCHES MAXIMUM IN, overall_height: 0.085 INCHES MAXIMUM IN, overall_length: 0.625 INCHES MAXIMUM IN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-176-9202, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

6134896-1

NSN: 5962-01-176-9202
FSC: 5962 — Microcircuits, Electronic
CAGE: 03640 — LOCKHEED MARTIN CORPORATION DIV ROTARY AND MISSION SYSTEMS (USA)

SPECIFICATIONS

body_width	0.030 INCHES MAXIMUM IN
body_height	0.085 INCHES MAXIMUM IN
body_length	0.625 INCHES MAXIMUM IN
overall_width	0.965 INCHES MAXIMUM IN
overall_height	0.085 INCHES MAXIMUM IN
overall_length	0.625 INCHES MAXIMUM IN
features_provided	BURN IN AND PROGRAMMABLE AND 3-STATE OUTPUT
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
NSN	5962-01-176-9202

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 11 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.030 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.085 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

OVERALL HEIGHT	0.085 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN	11 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.030 INCHES MAXIMUM IN
BODY HEIGHT	0.085 INCHES MAXIMUM IN
OVERALL LENGTH	0.625 INCHES MAXIMUM IN
OVERALL WIDTH	0.965 INCHES MAXIMUM IN
FEATURES PROVIDED	BURN IN AND PROGRAMMABLE AND 3-STATE OUTPUT
INCLOSURE CONFIGURATION	FLAT PACK

SUBSTITUTES & CROSS-REFERENCES 4

93451FMQBReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROM FAMILY 112Reference document

Same NSN cross-reference

Reference document — Secondary reference

82S181/BKAReference document

Same NSN cross-reference

Reference document — Secondary reference

6133402-4Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 6134896-1?

6134896-1 is a MICROCIRCUIT,MEMORY.

What parts can replace 6134896-1?

There are 4 known substitutes for 6134896-1: 93451FMQB, ROM/PROM FAMILY 112, 82S181/BKA and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 6134896-1?

6134896-1 is cataloged in the U.S. Government catalog under NSN 5962-01-176-9202. This indicates validated use in U.S. government and defense supply chains.

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6134896-1 — MICROCIRCUIT,MEMORY

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