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Technical Data Sheet

82S181/BKA — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

82S181/BKA: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.360 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN, body_height: 0.050 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN, body_length: 0.625 INCHES MAXIMUM IN, overall_width: 0.920 INCHES MINIMUM IN, overall_height: 0.050 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN, overall_length: 0.625 INCHES MAXIMUM IN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-176-3757, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
82S181/BKA
NSN: 5962-01-176-3757
NIINs: 011763757, 011763759, 011763760, 011769202, 011769203, 012274541, 012278227, 012278228, 012903898
FSC: 5962 — Microcircuits, Electronic
CAGE: 18324 — PHILIPS SEMICONDUCTORS INC (USA)
SPECIFICATIONS
body_width0.360 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN
body_height0.050 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN
body_length0.625 INCHES MAXIMUM IN
overall_width0.920 INCHES MINIMUM IN
overall_height0.050 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN
overall_length0.625 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND W/ENABLE AND MONOLITHIC
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
NSN5962-01-176-3757
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 82S181/BKA MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 14 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.400 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.085 INCHES MAXIMUM IN
•
FEATURES PROVIDED: MONOLITHIC AND PROGRAMMABLE AND 3-STATE OUTPUT
•
INCLOSURE CONFIGURATION: FLAT PACK
•
MEMORY DEVICE TYPE: ROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN14 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.400 INCHES MAXIMUM IN
BODY HEIGHT0.085 INCHES MAXIMUM IN
FEATURES PROVIDEDMONOLITHIC AND PROGRAMMABLE AND 3-STATE OUTPUT
INCLOSURE CONFIGURATIONFLAT PACK
MEMORY DEVICE TYPEROM
BODY LENGTH0.625 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 3
6133402-4Reference document
Same NSN cross-reference
Reference document — Secondary reference
ROM/PROM FAMILY 112Reference document
Same NSN cross-reference
Reference document — Secondary reference
93451FMQBReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is 82S181/BKA?
82S181/BKA is a MICROCIRCUIT,MEMORY.
What parts can replace 82S181/BKA?
There are 3 known substitutes for 82S181/BKA: 6133402-4, ROM/PROM FAMILY 112, 93451FMQB. Substitute compatibility should be verified for your specific system.
What is the NSN for 82S181/BKA?
82S181/BKA is cataloged in the U.S. Government catalog under NSN 5962-01-176-3757. This indicates validated use in U.S. government and defense supply chains.
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