ROM/PROM FAMILY 112: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.360 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN, body_height: 0.050 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN, body_length: 0.625 INCHES MAXIMUM IN, overall_width: 0.920 INCHES MINIMUM IN, overall_height: 0.050 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN, overall_length: 0.625 INCHES MAXIMUM IN. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-176-3757, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.360 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN |
| body_height | 0.050 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN |
| body_length | 0.625 INCHES MAXIMUM IN |
| overall_width | 0.920 INCHES MINIMUM IN |
| overall_height | 0.050 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN |
| overall_length | 0.625 INCHES MAXIMUM IN |
| features_provided | MONOLITHIC AND BIPOLAR AND DELAY, D-TYPE |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| NSN | 5962-01-176-3757 |
| INPUT CIRCUIT PATTERN | 14 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.400 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.085 INCHES MAXIMUM IN |
| FEATURES PROVIDED | MONOLITHIC AND PROGRAMMABLE AND 3-STATE OUTPUT |
| INCLOSURE CONFIGURATION | FLAT PACK |
| MEMORY DEVICE TYPE | ROM |
| BODY LENGTH | 0.625 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |