The Microcircuit,memory, cataloged under National Stock Number 5962-01-303-9935, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is The Boeing Company Div Defense. Government technical data includes 19 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 5 commercial cross-references from 3 manufacturers, enabling identification through both NSN and commercial part number lookups. 5 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-303-9935 |
| Primary Part Number | 70D184436-1009 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | The Boeing Company Div Defense |
| Status | ACTIVE |
| Body Height | 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN |
| Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| Terminal Type and Quantity | 28 PRINTED CIRCUIT |
| Memory Device Type | ROM |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Time Rating Per Chacteristic | 350.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 350.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Memory Capacity | UNKNOWN |
| Case Outline Source and Designator | D-10 MIL-M-38510 |
| Voltage Rating and Type Per Characteristic | 6.5 VOLTS MAXIMUM POWER SOURCE |
| Terminal Surface Treatment | SOLDER |
| Inclosure Material | CERAMIC |
| Input Circuit Pattern | 17 INPUT |
| Features Provided | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Inclosure Configuration | DUAL-IN-LINE |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Body Length | 1.490 INCHES MAXIMUM IN |
| Maximum Power Dissipation Rating | 1.0 WATTS |
| Body Width | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| ROM/PROM | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| 70D184436-2015 | The Boeing Company Div Defense (USA) |
| 8411101YA | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (standard Microcircuit (USA) |
| 70D184436-2009 | The Boeing Company Div Defense (USA) |
| 70D184436-1009 PRIMARY | The Boeing Company Div Defense (USA) |
NSN 5962-01-303-9935 is a Microcircuit,memory, manufactured by The Boeing Company Div Defense, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-303-9935 has 5 cross-referenced part numbers: ROM/PROM (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), 70D184436-2015 (The Boeing Company Div Defense), 8411101YA (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (standard Microcircuit), 70D184436-2009 (The Boeing Company Div Defense), 70D184436-1009 (The Boeing Company Div Defense).
There are 5 known substitutes for 5962-01-303-9935: 5962-01-200-7684, 5962-01-304-1414, 5962-01-338-2449 and 2 more. Verify interchangeability with system specifications before substitution.
Key specifications for 70D184436-1009: Body Height: 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN; Output Logic Form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC; Terminal Type and Quantity: 28 PRINTED CIRCUIT; Memory Device Type: ROM. 19 total characteristics are documented in the Federal Logistics Information System.