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Technical Data Sheet
70D184436-2009 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-303-9935, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
70D184436-2009
NSN: 5962-01-303-9935
FSC: 5962
CAGE: 76301 — THE BOEING COMPANY DIV DEFENSE (USA)
SPECIFICATIONS
body_width0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
body_length1.490 INCHES MAXIMUM IN
memory_capacityUNKNOWN
features_providedHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern17 INPUT
NSN5962-01-303-9935
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 70D184436-2009 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
BODY HEIGHT: 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
OUTPUT LOGIC FORM: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
TERMINAL TYPE AND QUANTITY: 28 PRINTED CIRCUIT
MEMORY DEVICE TYPE: ROM
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TIME RATING PER CHACTERISTIC: 350.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 350.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
MEMORY CAPACITY: UNKNOWN
CASE OUTLINE SOURCE AND DESIGNATOR: D-10 MIL-M-38510
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
BODY HEIGHT0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
OUTPUT LOGIC FORMN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
TERMINAL TYPE AND QUANTITY28 PRINTED CIRCUIT
MEMORY DEVICE TYPEROM
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TIME RATING PER CHACTERISTIC350.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 350.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
MEMORY CAPACITYUNKNOWN
CASE OUTLINE SOURCE AND DESIGNATORD-10 MIL-M-38510
VOLTAGE RATING AND TYPE PER CHARACTERISTIC6.5 VOLTS MAXIMUM POWER SOURCE
TERMINAL SURFACE TREATMENTSOLDER
VERIFIED SUBSTITUTES & CROSS-REFERENCES 11
84111Interchangeable
interchangeable cross-reference
interchangeable
8411101YXInterchangeable
interchangeable cross-reference
interchangeable
MD27256-35Interchangeable
interchangeable cross-reference
interchangeable
8411101YAInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROMInterchangeable
interchangeable cross-reference
interchangeable
70D184436-1023Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 70D184436-2009?
70D184436-2009 is a MICROCIRCUIT,MEMORY.
What parts can replace 70D184436-2009?
There are 11 known substitutes for 70D184436-2009: 84111, 8411101YX, MD27256-35 and 8 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 70D184436-2009?
70D184436-2009 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-303-9935. This indicates validated use in U.S. government and defense supply chains.
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