The Microcircuit,memory, cataloged under National Stock Number 5962-01-249-1887, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Honeywell International Inc. Dba Honeywell International Div Aerospace-Minneapolis. Government technical data includes 19 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 7 commercial cross-references from 5 manufacturers, enabling identification through both NSN and commercial part number lookups. 12 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-249-1887 |
| Primary Part Number | 10104656-102 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Honeywell International Inc. Dba Honeywell International Div Aerospace-Minneapolis |
| Status | ACTIVE |
| Inclosure Configuration | DUAL-IN-LINE |
| Operating Temp Range | -55.0 TO 100.0 CELSIUS DEGC |
| Input Circuit Pattern | 13 INPUT |
| Inclosure Material | CERAMIC |
| Memory Device Type | ROM |
| Voltage Rating and Type Per Characteristic | 6.0 VOLTS MAXIMUM POWER SOURCE |
| Case Outline Source and Designator | D-3 MIL-M-38510 |
| Time Rating Per Chacteristic | 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Memory Capacity | UNKNOWN |
| Terminal Surface Treatment | SOLDER |
| Terminal Type and Quantity | 24 PRINTED CIRCUIT |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| Storage Temp Range | -65.0 TO 125.0 CELSIUS DEGC |
| Body Height | 0.210 INCHES MAXIMUM IN |
| Features Provided | HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE AND ERASABLE |
| Body Length | 1.290 INCHES MAXIMUM IN |
| Maximum Power Dissipation Rating | 525.0 MILLIWATTS |
| Body Width | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| MCM2716BJXC | Freescale Semiconductor, Inc. (USA) |
| 10104656-102 PRIMARY | Honeywell International Inc. Dba Honeywell International Div Aerospace-Minneapolis (USA) |
| 10069392-101 | Honeywell International Inc. Dba Honeywell International Div Aerospace-Minneapolis (USA) |
| 10104656-T102 | Honeywell International Inc. Dba Honeywell International Div Aerospace-Minneapolis (USA) |
| AM2716DMB | Advanced Micro Devices Inc Dba AMD Austin (USA) |
| ROM/PROM FAMILY 020 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| MD2716/B | Intel Corp Sales Office (USA) |
NSN 5962-01-249-1887 is a Microcircuit,memory, manufactured by Honeywell International Inc. Dba Honeywell International Div Aerospace-Minneapolis, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-249-1887 has 7 cross-referenced part numbers: MCM2716BJXC (Freescale Semiconductor, Inc.), 10104656-102 (Honeywell International Inc. Dba Honeywell International Div Aerospace-Minneapolis), 10069392-101 (Honeywell International Inc. Dba Honeywell International Div Aerospace-Minneapolis), 10104656-T102 (Honeywell International Inc. Dba Honeywell International Div Aerospace-Minneapolis), AM2716DMB (Advanced Micro Devices Inc Dba AMD Austin) and 2 more.
There are 12 known substitutes for 5962-01-249-1887: 5962-01-081-9132, 5962-01-227-8294, 5962-01-227-8296 and 9 more. Verify interchangeability with system specifications before substitution.
Key specifications for 10104656-102: Inclosure Configuration: DUAL-IN-LINE; Operating Temp Range: -55.0 TO 100.0 CELSIUS DEGC; Input Circuit Pattern: 13 INPUT; Inclosure Material: CERAMIC. 19 total characteristics are documented in the Federal Logistics Information System.