The Microcircuit,memory, cataloged under National Stock Number 5962-01-203-1271, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is The Boeing Company Div Legacy Boeing Hb1. Government technical data includes 15 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 4 commercial cross-references from 3 manufacturers, enabling identification through both NSN and commercial part number lookups. 8 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-203-1271 |
| Primary Part Number | 13751-707-13 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | The Boeing Company Div Legacy Boeing Hb1 |
| Status | ACTIVE |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Terminal Surface Treatment | SOLDER |
| Memory Device Type | ROM |
| Terminal Type and Quantity | 24 PRINTED CIRCUIT |
| Voltage Rating and Type Per Characteristic | 6.0 VOLTS MAXIMUM POWER SOURCE |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Maximum Power Dissipation Rating | 790.0 MILLIWATTS |
| Features Provided | ELECTRICALLY ALTERABLE AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE |
| Body Width | 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN |
| Inclosure Material | CERAMIC AND GLASS |
| Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| Body Height | 0.145 INCHES MINIMUM AND 0.187 INCHES MAXIMUM IN |
| Inclosure Configuration | DUAL-IN-LINE |
| Input Circuit Pattern | 14 INPUT |
| Body Length | 1.235 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| 13751-707-13 PRIMARY | The Boeing Company Div Legacy Boeing Hb1 (USA) |
| MD2732A-25/B | Intel Corp Sales Office (USA) |
| 477-1835-002 | The Boeing Company Div Legacy Boeing Hb1 (USA) |
| ROM/PROM | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
NSN 5962-01-203-1271 is a Microcircuit,memory, manufactured by The Boeing Company Div Legacy Boeing Hb1, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-203-1271 has 4 cross-referenced part numbers: 13751-707-13 (The Boeing Company Div Legacy Boeing Hb1), MD2732A-25/B (Intel Corp Sales Office), 477-1835-002 (The Boeing Company Div Legacy Boeing Hb1), ROM/PROM (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)).
There are 8 known substitutes for 5962-01-203-1271: 5962-01-158-9903, 5962-01-176-5716, 5962-01-202-8614 and 5 more. Verify interchangeability with system specifications before substitution.
Key specifications for 13751-707-13: Storage Temp Range: -65.0 TO 150.0 CELSIUS DEGC; Terminal Surface Treatment: SOLDER; Memory Device Type: ROM; Terminal Type and Quantity: 24 PRINTED CIRCUIT. 15 total characteristics are documented in the Federal Logistics Information System.