PartsTable TECHNICAL DATA SHEET
JULY 2026Technical Data Sheet

13751-707-7Microcircuit,memory

The Boeing Company Div Legacy Boeing Hb1 · NSN 5962-01-202-8615 · FSC 5962 · No Item Name Available
Verified by PartsTable
NSN 5962-01-202-8615 — this item is cataloged by the U.S. Government under National Stock Number 5962-01-202-8615. Primary manufacturer part number: 13751-707-7.
Features
  • Microcircuit,memory — FSC 5962
  • Inclosure Configuration: DUAL-IN-LINE
  • Memory Device Type: ROM
  • Voltage Rating and Type Per Characteristic: 6.0 VOLTS MAXIMUM POWER SOURCE
  • Terminal Surface Treatment: SOLDER
  • Terminal Type and Quantity: 24 PRINTED CIRCUIT
  • Operating Temp Range: -55.0 TO 125.0 CELSIUS DEGC
  • Input Circuit Pattern: 14 INPUT
Applications
  • Industrial maintenance and repair
  • Government and military logistics
  • Equipment overhaul and refurbishment
General Description

The Microcircuit,memory, cataloged under National Stock Number 5962-01-202-8615, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is The Boeing Company Div Legacy Boeing Hb1. Government technical data includes 15 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 4 commercial cross-references from 3 manufacturers, enabling identification through both NSN and commercial part number lookups. 8 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.

Technical Specifications
ParameterValue
NSN5962-01-202-8615
Primary Part Number13751-707-7
Item NameMicrocircuit,memory
FSC / FSG5962 / 59 — No Item Name Available
ManufacturerThe Boeing Company Div Legacy Boeing Hb1
StatusACTIVE
Inclosure ConfigurationDUAL-IN-LINE
Memory Device TypeROM
Voltage Rating and Type Per Characteristic6.0 VOLTS MAXIMUM POWER SOURCE
Terminal Surface TreatmentSOLDER
Terminal Type and Quantity24 PRINTED CIRCUIT
Operating Temp Range-55.0 TO 125.0 CELSIUS DEGC
Input Circuit Pattern14 INPUT
Maximum Power Dissipation Rating790.0 MILLIWATTS
Body Height0.145 INCHES MINIMUM AND 0.187 INCHES MAXIMUM IN
Body Length1.235 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN
Storage Temp Range-65.0 TO 150.0 CELSIUS DEGC
Inclosure MaterialCERAMIC AND GLASS
Body Width0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
Features ProvidedELECTRICALLY ALTERABLE AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE
Output Logic FormN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
Lifecycle & Compliance
Acquisition StatusACTIVE
HAZMATNo
Verified Substitutes 8
5962-01-158-9903G165205-1 INTERCHANGEABLE
Microcircuit,memory
Raytheon Company Dba Raytheon Co
5962-01-176-5716 INTERCHANGEABLE
Microcircuit,memory
5962-01-202-861413751-707-3 INTERCHANGEABLE
Microcircuit,memory
The Boeing Company Div Legacy Boeing Hb1
5962-01-203-126913751-707-5 INTERCHANGEABLE
Microcircuit,memory
The Boeing Company Div Legacy Boeing Hb1
5962-01-203-127013751-707-9 INTERCHANGEABLE
Microcircuit,memory
The Boeing Company Div Legacy Boeing Hb1
5962-01-203-127113751-707-13 INTERCHANGEABLE
Microcircuit,memory
The Boeing Company Div Legacy Boeing Hb1
5962-01-267-7052 INTERCHANGEABLE
Microcircuit,linear
5962-01-345-1145750705-4 INTERCHANGEABLE
Microcircuit,memory
General Dynamics Ots (aerospace), Inc. Dba General Dynamics Ordinance and Tactical Systems Div Seattle Operations
Cross-Reference Index
Part NumberManufacturer
13751-707-7 PRIMARY The Boeing Company Div Legacy Boeing Hb1 (USA)
477-1835-002 The Boeing Company Div Legacy Boeing Hb1 (USA)
ROM/PROM FAMILY 042 Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA)
MD2732A-25/B Intel Corp Sales Office (USA)
Related Parts
5962-01-158-9903INTERCHANGEABLE
MICROCIRCUIT,MEMORY
G165205-1
5962-01-176-5716INTERCHANGEABLE
MICROCIRCUIT,MEMORY
5962-01-202-8614INTERCHANGEABLE
MICROCIRCUIT,MEMORY
13751-707-3
5962-01-203-1269INTERCHANGEABLE
MICROCIRCUIT,MEMORY
13751-707-5
5962-01-203-1270INTERCHANGEABLE
MICROCIRCUIT,MEMORY
13751-707-9
5962-01-203-1271INTERCHANGEABLE
MICROCIRCUIT,MEMORY
13751-707-13
5962-01-267-7052INTERCHANGEABLE
MICROCIRCUIT,LINEAR
5962-01-345-1145INTERCHANGEABLE
MICROCIRCUIT,MEMORY
750705-4

Frequently Asked Questions

What is NSN 5962-01-202-8615?

NSN 5962-01-202-8615 is a Microcircuit,memory, manufactured by The Boeing Company Div Legacy Boeing Hb1, classified under FSC 5962 (No Item Name Available). Status: active.

What are the part numbers for NSN 5962-01-202-8615?

NSN 5962-01-202-8615 has 4 cross-referenced part numbers: 13751-707-7 (The Boeing Company Div Legacy Boeing Hb1), 477-1835-002 (The Boeing Company Div Legacy Boeing Hb1), ROM/PROM FAMILY 042 (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), MD2732A-25/B (Intel Corp Sales Office).

What NSN replaces 5962-01-202-8615?

There are 8 known substitutes for 5962-01-202-8615: 5962-01-158-9903, 5962-01-176-5716, 5962-01-202-8614 and 5 more. Verify interchangeability with system specifications before substitution.

What are the specifications of 13751-707-7?

Key specifications for 13751-707-7: Inclosure Configuration: DUAL-IN-LINE; Memory Device Type: ROM; Voltage Rating and Type Per Characteristic: 6.0 VOLTS MAXIMUM POWER SOURCE; Terminal Surface Treatment: SOLDER. 15 total characteristics are documented in the Federal Logistics Information System.

Validated with multiple authoritative sources, including Government, OEM, and Certified sources.
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