The Microcircuit,memory, cataloged under National Stock Number 5962-01-202-8614, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is The Boeing Company Div Legacy Boeing Hb1. Government technical data includes 15 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 4 commercial cross-references from 3 manufacturers, enabling identification through both NSN and commercial part number lookups. 8 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-202-8614 |
| Primary Part Number | 13751-707-3 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | The Boeing Company Div Legacy Boeing Hb1 |
| Status | ACTIVE |
| Body Length | 1.235 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN |
| Input Circuit Pattern | 14 INPUT |
| Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| Body Width | 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN |
| Terminal Surface Treatment | SOLDER |
| Voltage Rating and Type Per Characteristic | 6.0 VOLTS MAXIMUM POWER SOURCE |
| Terminal Type and Quantity | 24 PRINTED CIRCUIT |
| Memory Device Type | ROM |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Features Provided | BURN IN, MIL-STD-883, CLASS B AND ERASABLE AND HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND 3-STATE OUTPUT |
| Inclosure Configuration | DUAL-IN-LINE |
| Body Height | 0.145 INCHES MINIMUM AND 0.187 INCHES MAXIMUM IN |
| Inclosure Material | CERAMIC AND GLASS |
| Maximum Power Dissipation Rating | 790.0 MILLIWATTS |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| 477-1835-002 | The Boeing Company Div Legacy Boeing Hb1 (USA) |
| 13751-707-3 PRIMARY | The Boeing Company Div Legacy Boeing Hb1 (USA) |
| ROM/PROM | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| MD2732A-25/B | Intel Corp Sales Office (USA) |
NSN 5962-01-202-8614 is a Microcircuit,memory, manufactured by The Boeing Company Div Legacy Boeing Hb1, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-202-8614 has 4 cross-referenced part numbers: 477-1835-002 (The Boeing Company Div Legacy Boeing Hb1), 13751-707-3 (The Boeing Company Div Legacy Boeing Hb1), ROM/PROM (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), MD2732A-25/B (Intel Corp Sales Office).
There are 8 known substitutes for 5962-01-202-8614: 5962-01-158-9903, 5962-01-176-5716, 5962-01-202-8615 and 5 more. Verify interchangeability with system specifications before substitution.
Key specifications for 13751-707-3: Body Length: 1.235 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN; Input Circuit Pattern: 14 INPUT; Output Logic Form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC; Body Width: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN. 15 total characteristics are documented in the Federal Logistics Information System.