The Microcircuit,memory, cataloged under National Stock Number 5962-01-181-3108, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Lockheed Martin Corporation Div Lockheed Martin Aeronautics Company. Government technical data includes 17 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 3 commercial cross-references from 3 manufacturers, enabling identification through both NSN and commercial part number lookups. 2 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-181-3108 |
| Primary Part Number | C10582-1 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Lockheed Martin Corporation Div Lockheed Martin Aeronautics Company |
| Status | ACTIVE |
| Body Width | 0.310 INCHES MAXIMUM IN |
| Body Height | 0.185 INCHES NOMINAL IN |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Features Provided | HERMETICALLY SEALED AND BIPOLAR AND PROGRAMMABLE AND SCHOTTKY AND 3-STATE OUTPUT AND ELECTROSTATIC SENSITIVE |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Terminal Type and Quantity | 16 PRINTED CIRCUIT |
| Voltage Rating and Type Per Characteristic | 5.5 VOLTS MAXIMUM POWER SOURCE |
| Time Rating Per Chacteristic | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS |
| Memory Device Type | ROM |
| Terminal Surface Treatment | SOLDER |
| Memory Capacity | UNKNOWN |
| Input Circuit Pattern | 6 INPUT |
| Inclosure Configuration | DUAL-IN-LINE |
| Body Length | 0.870 INCHES MAXIMUM IN |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Inclosure Material | CERAMIC AND GLASS |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| AM27S19DMB | Advanced Micro Devices Inc Dba AMD Austin (USA) |
| 570846-1 | L3 Technologies, Inc. Dba Telementry & Rf Products Div L3 Technologies, Telemetry & Rf Products (USA) |
| C10582-1 PRIMARY | Lockheed Martin Corporation Div Lockheed Martin Aeronautics Company (USA) |
NSN 5962-01-181-3108 is a Microcircuit,memory, manufactured by Lockheed Martin Corporation Div Lockheed Martin Aeronautics Company, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-181-3108 has 3 cross-referenced part numbers: AM27S19DMB (Advanced Micro Devices Inc Dba AMD Austin), 570846-1 (L3 Technologies, Inc. Dba Telementry & Rf Products Div L3 Technologies, Telemetry & Rf Products), C10582-1 (Lockheed Martin Corporation Div Lockheed Martin Aeronautics Company).
There are 2 known substitutes for 5962-01-181-3108: 5962-01-308-5513, 5962-01-439-4322. Verify interchangeability with system specifications before substitution.
Key specifications for C10582-1: Body Width: 0.310 INCHES MAXIMUM IN; Body Height: 0.185 INCHES NOMINAL IN; Operating Temp Range: -55.0 TO 125.0 CELSIUS DEGC; Features Provided: HERMETICALLY SEALED AND BIPOLAR AND PROGRAMMABLE AND SCHOTTKY AND 3-STATE OUTPUT AND ELECTROSTATIC SENSITIVE. 17 total characteristics are documented in the Federal Logistics Information System.