Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: C10582-1

C10582-1 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES NOMINAL IN, body_length: 0.870 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND BIPOLAR AND PROGRAMMABLE AND SCHOTTKY AND 3-STATE OUTPUT AND ELECTROSTATIC SENSITIVE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-181-3108, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

C10582-1

NSN: 5962-01-181-3108
FSC: 5962
CAGE: 81755 — LOCKHEED MARTIN CORPORATION DIV LOCKHEED MARTIN AERONAUTICS COMPANY (USA)

SPECIFICATIONS

body_width	0.310 INCHES MAXIMUM IN
body_height	0.185 INCHES NOMINAL IN
body_length	0.870 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND BIPOLAR AND PROGRAMMABLE AND SCHOTTKY AND 3-STATE OUTPUT AND ELECTROSTATIC SENSITIVE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	6 INPUT
NSN	5962-01-181-3108

COMPONENT DIAGRAM

KEY FEATURES

•

BODY WIDTH: 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.185 INCHES NOMINAL IN

•

OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BIPOLAR AND PROGRAMMABLE AND SCHOTTKY AND 3-STATE OUTPUT AND ELECTROSTATIC SENSITIVE

•

TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

•

TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS MAXIMUM POWER SOURCE

•

TIME RATING PER CHACTERISTIC: 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

BODY WIDTH	0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.185 INCHES NOMINAL IN
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
FEATURES PROVIDED	HERMETICALLY SEALED AND BIPOLAR AND PROGRAMMABLE AND SCHOTTKY AND 3-STATE OUTPUT AND ELECTROSTATIC SENSITIVE
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TERMINAL TYPE AND QUANTITY	16 PRINTED CIRCUIT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	5.5 VOLTS MAXIMUM POWER SOURCE
TIME RATING PER CHACTERISTIC	50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS
MEMORY DEVICE TYPE	ROM
TERMINAL SURFACE TREATMENT	SOLDER

VERIFIED SUBSTITUTES & CROSS-REFERENCES 7

AM27S19DCInterchangeable