AM27S19DMB: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.270 INCHES NOMINAL IN, body_height: 0.155 INCHES NOMINAL IN, body_length: 0.755 INCHES MINIMUM AND 0.780 INCHES MAXIMUM IN, overall_height: 0.335 INCHES NOMINAL IN, memory_capacity: UNKNOWN, features_provided: ELECTROSTATIC SENSITIVE AND PROGRAMMED AND MONOLITHIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-027-3791, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.270 INCHES NOMINAL IN |
| body_height | 0.155 INCHES NOMINAL IN |
| body_length | 0.755 INCHES MINIMUM AND 0.780 INCHES MAXIMUM IN |
| overall_height | 0.335 INCHES NOMINAL IN |
| memory_capacity | UNKNOWN |
| features_provided | ELECTROSTATIC SENSITIVE AND PROGRAMMED AND MONOLITHIC |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| NSN | 5962-01-027-3791 |
| INPUT CIRCUIT PATTERN | 6 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.294 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.154 INCHES MINIMUM AND 0.179 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND BIPOLAR AND PROGRAMMABLE AND PROGRAMMED AND W/BUFFERED OUTPUT AND W/ENABLE |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MEMORY DEVICE TYPE | ROM |
| BODY LENGTH | 0.808 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |