The Microcircuit,memory, cataloged under National Stock Number 5962-01-118-6409, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Lockheed Martin Corporation Div Lockheed Martin Information Systems & Global Solutions. Government technical data includes 16 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 7 commercial cross-references from 5 manufacturers, enabling identification through both NSN and commercial part number lookups. 12 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-118-6409 |
| Primary Part Number | 312852-02 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Lockheed Martin Corporation Div Lockheed Martin Information Systems & Global Solutions |
| Status | ACTIVE |
| Operating Temp Range | +0.0 TO 70.0 CELSIUS DEGC |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Memory Device Type | ROM |
| Memory Capacity | UNKNOWN |
| Test Data Document | 11530-312852 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| Terminal Type and Quantity | 24 PRINTED CIRCUIT |
| Voltage Rating and Type Per Characteristic | 5.5 VOLTS MAXIMUM POWER SOURCE |
| Terminal Surface Treatment | SOLDER |
| Inclosure Material | CERAMIC |
| Body Length | 1.250 INCHES MAXIMUM IN |
| Features Provided | HERMETICALLY SEALED AND MONOLITHIC AND W/ENABLE AND PROGRAMMED AND RESETTABLE |
| Body Height | 0.180 INCHES MAXIMUM IN |
| Input Circuit Pattern | 12 INPUT |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Body Width | 0.490 INCHES MINIMUM AND 0.510 INCHES MAXIMUM IN |
| Inclosure Configuration | DUAL-IN-LINE |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| BC0928578 | Rohde & Schwarz Gmbh & Co. Kommanditgesellschaft Dba R & S (DEU) |
| B2716 | Intel Corp Sales Office (USA) |
| ROM/PROM FAMILY 020 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| 312852-02 | Lockheed Martin Corporation Div Lockheed Martin Information Systems & Global Solutions (USA) |
| 312852-02 PRIMARY | Lockheed Martin Corporation Div Lockheed Martin Information Systems & Global Solutions (USA) |
| D2716 | Intel Corp Sales Office (USA) |
| 31-9010 | Racal Instruments Wireless Solutions Ltd, an Aeroflex Company (GBR) |
NSN 5962-01-118-6409 is a Microcircuit,memory, manufactured by Lockheed Martin Corporation Div Lockheed Martin Information Systems & Global Solutions, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-118-6409 has 7 cross-referenced part numbers: BC0928578 (Rohde & Schwarz Gmbh & Co. Kommanditgesellschaft Dba R & S), B2716 (Intel Corp Sales Office), ROM/PROM FAMILY 020 (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), 312852-02 (Lockheed Martin Corporation Div Lockheed Martin Information Systems & Global Solutions), 312852-02 (Lockheed Martin Corporation Div Lockheed Martin Information Systems & Global Solutions) and 2 more.
There are 12 known substitutes for 5962-01-118-6409: 5962-01-086-2717, 5962-01-090-1169, 5962-01-107-1082 and 9 more. Verify interchangeability with system specifications before substitution.
Key specifications for 312852-02: Operating Temp Range: +0.0 TO 70.0 CELSIUS DEGC; Output Logic Form: TRANSISTOR-TRANSISTOR LOGIC; Memory Device Type: ROM; Memory Capacity: UNKNOWN. 17 total characteristics are documented in the Federal Logistics Information System.