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Technical Data Sheet
B2716 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
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Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN, body_length: 1.235 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN, bit_quantity: 16384, word_quantity: 2048, memory_capacity: UNKNOWN. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-086-2717, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
B2716
NSN: 5962-01-086-2717
FSC: 5962
CAGE: 34649 — INTEL CORP SALES OFFICE (USA)
SPECIFICATIONS
body_width0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
body_height0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN
body_length1.235 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN
bit_quantity16384
word_quantity2048
memory_capacityUNKNOWN
features_providedHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC AND GLASS
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-65.0 TO 135.0 CELSIUS DEGC
NSN5962-01-086-2717
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN B2716 MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
OPERATING TEMP RANGE: +0.0 TO 70.0 CELSIUS DEGC
MEMORY DEVICE TYPE: ROM
MAXIMUM POWER DISSIPATION RATING: 540.0 MILLIWATTS
BIT QUANTITY: 16384
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
BODY WIDTH: 0.590 INCHES NOMINAL IN
INCLOSURE MATERIAL: CERAMIC
TECHNICAL CHARACTERISTICS (FLIS)
OPERATING TEMP RANGE+0.0 TO 70.0 CELSIUS DEGC
MEMORY DEVICE TYPEROM
MAXIMUM POWER DISSIPATION RATING540.0 MILLIWATTS
BIT QUANTITY16384
TERMINAL SURFACE TREATMENTSOLDER
TERMINAL TYPE AND QUANTITY24 PRINTED CIRCUIT
BODY WIDTH0.590 INCHES NOMINAL IN
INCLOSURE MATERIALCERAMIC
BODY LENGTH1.290 INCHES MAXIMUM IN
OUTPUT LOGIC FORMMETAL OXIDE-SEMICONDUCTOR LOGIC
VERIFIED SUBSTITUTES & CROSS-REFERENCES 16
86327Interchangeable
interchangeable cross-reference
interchangeable
213Z111U01Interchangeable
interchangeable cross-reference
interchangeable
TMS2716-45JLInterchangeable
interchangeable cross-reference
interchangeable
MD2716Interchangeable
interchangeable cross-reference
interchangeable
3310-0402Interchangeable
interchangeable cross-reference
interchangeable
810AS829Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is B2716?
B2716 is a MICROCIRCUIT,DIGITAL.
What parts can replace B2716?
There are 16 known substitutes for B2716: 86327, 213Z111U01, TMS2716-45JL and 13 more. Substitute compatibility should be verified for your specific system.
What is the NSN for B2716?
B2716 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-086-2717. This indicates validated use in U.S. government and defense supply chains.
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