The Microcircuit,memory, cataloged under National Stock Number 5962-01-113-9035, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Lockheed Martin Corporation Div Lockheed Martin Information Systems & Global Solutions. Government technical data includes 16 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 4 commercial cross-references from 3 manufacturers, enabling identification through both NSN and commercial part number lookups. 12 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-113-9035 |
| Primary Part Number | 312853-02 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Lockheed Martin Corporation Div Lockheed Martin Information Systems & Global Solutions |
| Status | ACTIVE |
| Memory Device Type | ROM |
| Voltage Rating and Type Per Characteristic | 6.0 VOLTS MAXIMUM POWER SOURCE |
| Time Rating Per Chacteristic | 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Terminal Surface Treatment | SOLDER |
| Terminal Type and Quantity | 24 PRINTED CIRCUIT |
| Test Data Document | 60854-312853 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| Inclosure Configuration | DUAL-IN-LINE |
| Body Length | 1.250 INCHES MAXIMUM IN |
| Body Height | 0.180 INCHES MAXIMUM IN |
| Storage Temp Range | -65.0 TO 125.0 CELSIUS DEGC |
| Inclosure Material | CERAMIC |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Input Circuit Pattern | 14 INPUT |
| Body Width | 0.500 INCHES NOMINAL IN |
| Features Provided | HERMETICALLY SEALED AND PROGRAMMABLE AND MONOLITHIC AND W/ENABLE |
| Operating Temp Range | +0.0 TO 70.0 CELSIUS DEGC |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| 312853-02 | Lockheed Martin Corporation Div Lockheed Martin Information Systems & Global Solutions (USA) |
| D2716 | Intel Corp Sales Office (USA) |
| ROM/PROM FAMILY 020 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| 312853-02 PRIMARY | Lockheed Martin Corporation Div Lockheed Martin Information Systems & Global Solutions (USA) |
NSN 5962-01-113-9035 is a Microcircuit,memory, manufactured by Lockheed Martin Corporation Div Lockheed Martin Information Systems & Global Solutions, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-113-9035 has 4 cross-referenced part numbers: 312853-02 (Lockheed Martin Corporation Div Lockheed Martin Information Systems & Global Solutions), D2716 (Intel Corp Sales Office), ROM/PROM FAMILY 020 (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), 312853-02 (Lockheed Martin Corporation Div Lockheed Martin Information Systems & Global Solutions).
There are 12 known substitutes for 5962-01-113-9035: 5962-01-090-1169, 5962-01-107-1082, 5962-01-118-6409 and 9 more. Verify interchangeability with system specifications before substitution.
Key specifications for 312853-02: Memory Device Type: ROM; Voltage Rating and Type Per Characteristic: 6.0 VOLTS MAXIMUM POWER SOURCE; Time Rating Per Chacteristic: 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS; Terminal Surface Treatment: SOLDER. 16 total characteristics are documented in the Federal Logistics Information System.