The Microcircuit,memory, cataloged under National Stock Number 5962-01-109-7816, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Lockheed Martin Corporation Div Lockheed Martin Aeronautics Company. Government technical data includes 19 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 3 commercial cross-references from 3 manufacturers, enabling identification through both NSN and commercial part number lookups. 8 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-109-7816 |
| Primary Part Number | 654P5501-3 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Lockheed Martin Corporation Div Lockheed Martin Aeronautics Company |
| Status | ACTIVE |
| Maximum Power Dissipation Rating | 1.0 WATTS |
| Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| Inclosure Configuration | DUAL-IN-LINE |
| Case Outline Source and Designator | D-3 MIL-M-38510 |
| Time Rating Per Chacteristic | 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Voltage Rating and Type Per Characteristic | 6.0 VOLTS MAXIMUM POWER SOURCE |
| Memory Capacity | UNKNOWN |
| Memory Device Type | ROM |
| Terminal Surface Treatment | SOLDER |
| Terminal Type and Quantity | 24 PRINTED CIRCUIT |
| Test Data Document | 81755-654+5501 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| Body Length | 1.290 INCHES MAXIMUM IN |
| Features Provided | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE AND W/BUFFERED OUTPUT |
| Inclosure Material | CERAMIC AND GLASS |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Input Circuit Pattern | 11 INPUT |
| Body Height | 0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN |
| Body Width | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN |
| Storage Temp Range | -65.0 TO 125.0 CELSIUS DEGC |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| ROM/PROM FAMILY 020 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| M38510/22101BJB | Military Specifications Promulgated by Military Departments/agencies Under Authority of Defense Standardization Manual 4120 3-M |
| 654P5501-3 PRIMARY | Lockheed Martin Corporation Div Lockheed Martin Aeronautics Company (USA) |
NSN 5962-01-109-7816 is a Microcircuit,memory, manufactured by Lockheed Martin Corporation Div Lockheed Martin Aeronautics Company, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-109-7816 has 3 cross-referenced part numbers: ROM/PROM FAMILY 020 (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), M38510/22101BJB (Military Specifications Promulgated by Military Departments/agencies Under Authority of Defense Standardization Manual 4120 3-M), 654P5501-3 (Lockheed Martin Corporation Div Lockheed Martin Aeronautics Company).
There are 8 known substitutes for 5962-01-109-7816: 5962-01-109-6983, 5962-01-109-6984, 5962-01-109-7817 and 5 more. Verify interchangeability with system specifications before substitution.
Key specifications for 654P5501-3: Maximum Power Dissipation Rating: 1.0 WATTS; Output Logic Form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC; Inclosure Configuration: DUAL-IN-LINE; Case Outline Source and Designator: D-3 MIL-M-38510. 20 total characteristics are documented in the Federal Logistics Information System.