The Microcircuit,memory, cataloged under National Stock Number 5962-01-110-8117, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Lockheed Martin Corporation Div Lockheed Martin Aeronautics Company. Government technical data includes 19 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 3 commercial cross-references from 3 manufacturers, enabling identification through both NSN and commercial part number lookups. 8 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-110-8117 |
| Primary Part Number | 654P5501-1 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Lockheed Martin Corporation Div Lockheed Martin Aeronautics Company |
| Status | ACTIVE |
| Body Length | 1.290 INCHES MAXIMUM IN |
| Inclosure Material | CERAMIC AND GLASS |
| Memory Device Type | ROM |
| Terminal Type and Quantity | 24 PRINTED CIRCUIT |
| Terminal Surface Treatment | SOLDER |
| Memory Capacity | UNKNOWN |
| Time Rating Per Chacteristic | 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Case Outline Source and Designator | D-3 MIL-M-38510 |
| Voltage Rating and Type Per Characteristic | 6.0 VOLTS MAXIMUM POWER SOURCE |
| Test Data Document | 81755-654+5501 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Storage Temp Range | -65.0 TO 125.0 CELSIUS DEGC |
| Features Provided | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE AND W/BUFFERED OUTPUT |
| Input Circuit Pattern | 11 INPUT |
| Inclosure Configuration | DUAL-IN-LINE |
| Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| Maximum Power Dissipation Rating | 1.0 WATTS |
| Body Width | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN |
| Body Height | 0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| 654P5501-1 PRIMARY | Lockheed Martin Corporation Div Lockheed Martin Aeronautics Company (USA) |
| M38510/22101BJB | Military Specifications Promulgated by Military Departments/agencies Under Authority of Defense Standardization Manual 4120 3-M |
| ROM/PROM FAMILY 020 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
NSN 5962-01-110-8117 is a Microcircuit,memory, manufactured by Lockheed Martin Corporation Div Lockheed Martin Aeronautics Company, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-110-8117 has 3 cross-referenced part numbers: 654P5501-1 (Lockheed Martin Corporation Div Lockheed Martin Aeronautics Company), M38510/22101BJB (Military Specifications Promulgated by Military Departments/agencies Under Authority of Defense Standardization Manual 4120 3-M), ROM/PROM FAMILY 020 (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)).
There are 8 known substitutes for 5962-01-110-8117: 5962-01-109-6983, 5962-01-109-6984, 5962-01-109-7816 and 5 more. Verify interchangeability with system specifications before substitution.
Key specifications for 654P5501-1: End Item Identification: TRAINING SET,ELECTRONIC WARFARE,TYPE AN/MST-T1; Body Length: 1.290 INCHES MAXIMUM IN; Inclosure Material: CERAMIC AND GLASS; Memory Device Type: ROM. 20 total characteristics are documented in the Federal Logistics Information System.