The Microcircuit,memory, cataloged under National Stock Number 5962-00-153-6599, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Lockheed Martin Corporation Div Lockheed Martin Systems & Global Solutions. Government technical data includes 8 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 4 commercial cross-references from 3 manufacturers, enabling identification through both NSN and commercial part number lookups. 1 verified substitute exists in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-00-153-6599 |
| Primary Part Number | 3008366-012-89 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Lockheed Martin Corporation Div Lockheed Martin Systems & Global Solutions |
| Status | ACTIVE |
| Features Provided | HERMETICALLY SEALED AND MONOLITHIC |
| Body Width | 0.280 INCHES NOMINAL IN |
| Memory Device Type | DIODE MATRIX |
| Body Height | 0.180 INCHES NOMINAL IN |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Body Length | 0.785 INCHES NOMINAL IN |
| Inclosure Configuration | DUAL-IN-LINE |
| Inclosure Material | CERAMIC |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| ROM/PROM FAMILY 057 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| HM1-0168-2 | Renesas Electronics America Inc (USA) |
| 3008366-012-89 | Renesas Electronics America Inc (USA) |
| 3008366-012-89 PRIMARY | Lockheed Martin Corporation Div Lockheed Martin Systems & Global Solutions (USA) |
NSN 5962-00-153-6599 is a Microcircuit,memory, manufactured by Lockheed Martin Corporation Div Lockheed Martin Systems & Global Solutions, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-00-153-6599 has 4 cross-referenced part numbers: ROM/PROM FAMILY 057 (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), HM1-0168-2 (Renesas Electronics America Inc), 3008366-012-89 (Renesas Electronics America Inc), 3008366-012-89 (Lockheed Martin Corporation Div Lockheed Martin Systems & Global Solutions).
There is 1 known substitute for 5962-00-153-6599: 5962-00-350-8431. Verify interchangeability with system specifications before substitution.
Key specifications for 3008366-012-89: Features Provided: HERMETICALLY SEALED AND MONOLITHIC; Body Width: 0.280 INCHES NOMINAL IN; Memory Device Type: DIODE MATRIX; Body Height: 0.180 INCHES NOMINAL IN. 9 total characteristics are documented in the Federal Logistics Information System.