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Technical Data Sheet
PartsTable / COMPONENT / 3008366-012-89
3008366-012-89 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.280 INCHES NOMINAL IN, body_height: 0.180 INCHES NOMINAL IN, body_length: 0.785 INCHES NOMINAL IN, special_features: SILICON EPITAXIAL CIRCUIT, features_provided: HERMETICALLY SEALED AND MONOLITHIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-153-6599, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
3008366-012-89
NSN: 5962-00-153-6599
FSC: 5962
CAGE: 34371 — RENESAS ELECTRONICS AMERICA INC (USA)
SPECIFICATIONS
body_width0.280 INCHES NOMINAL IN
body_height0.180 INCHES NOMINAL IN
body_length0.785 INCHES NOMINAL IN
special_featuresSILICON EPITAXIAL CIRCUIT
features_providedHERMETICALLY SEALED AND MONOLITHIC
inclosure_materialCERAMIC
memory_device_typeDIODE MATRIX
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationDUAL-IN-LINE
NSN5962-00-153-6599
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 3008366-012-89 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC
•
BODY WIDTH: 0.280 INCHES NOMINAL IN
•
MEMORY DEVICE TYPE: DIODE MATRIX
•
BODY HEIGHT: 0.180 INCHES NOMINAL IN
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
•
BODY LENGTH: 0.785 INCHES NOMINAL IN
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
INCLOSURE MATERIAL: CERAMIC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
FEATURES PROVIDEDHERMETICALLY SEALED AND MONOLITHIC
BODY WIDTH0.280 INCHES NOMINAL IN
MEMORY DEVICE TYPEDIODE MATRIX
BODY HEIGHT0.180 INCHES NOMINAL IN
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
BODY LENGTH0.785 INCHES NOMINAL IN
INCLOSURE CONFIGURATIONDUAL-IN-LINE
INCLOSURE MATERIALCERAMIC
SPECIAL FEATURESSILICON EPITAXIAL CIRCUIT
VERIFIED SUBSTITUTES & CROSS-REFERENCES 4
HM1-0034-2Interchangeable
interchangeable cross-reference
interchangeable
HM1-0168-2Interchangeable
interchangeable cross-reference
interchangeable
SM-B-525288Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROM FAMILY 057Interchangeable
Same NIIN cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 3008366-012-89?
3008366-012-89 is a MICROCIRCUIT,MEMORY.
What parts can replace 3008366-012-89?
There are 4 known substitutes for 3008366-012-89: HM1-0034-2, HM1-0168-2, SM-B-525288 and 1 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 3008366-012-89?
3008366-012-89 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-153-6599. This indicates validated use in U.S. government and defense supply chains.
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✓ Validated with multiple authoritative sources, including Government, OEM, and Certified sources.
PartsTable Design LLC · partstable.com
Last verified: July 2026