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Technical Data Sheet
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3542372 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.275 INCHES MAXIMUM IN, body_height: 0.085 INCHES MAXIMUM IN, body_length: 0.395 INCHES MAXIMUM IN, overall_width: 0.960 INCHES MAXIMUM IN, overall_height: 0.085 INCHES MAXIMUM IN, overall_length: 0.395 INCHES MAXIMUM IN. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-075-6861, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
3542372
NSN: 5962-01-075-6861
FSC: 5962
CAGE: 50364 — MMI/AMD (USA)
SPECIFICATIONS
body_width0.275 INCHES MAXIMUM IN
body_height0.085 INCHES MAXIMUM IN
body_length0.395 INCHES MAXIMUM IN
overall_width0.960 INCHES MAXIMUM IN
overall_height0.085 INCHES MAXIMUM IN
overall_length0.395 INCHES MAXIMUM IN
features_providedBIPOLAR AND BURN IN AND PROGRAMMED
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
NSN5962-01-075-6861
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 3542372 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
BODY HEIGHT: 0.085 INCHES MAXIMUM IN
•
INCLOSURE CONFIGURATION: FLAT PACK
•
BODY WIDTH: 0.275 INCHES MAXIMUM IN
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE
•
TERMINAL SURFACE TREATMENT: SOLDER
•
MEMORY DEVICE TYPE: ROM
•
TERMINAL TYPE AND QUANTITY: 16 FLAT LEADS
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
BODY HEIGHT0.085 INCHES MAXIMUM IN
INCLOSURE CONFIGURATIONFLAT PACK
BODY WIDTH0.275 INCHES MAXIMUM IN
VOLTAGE RATING AND TYPE PER CHARACTERISTIC7.0 VOLTS MAXIMUM POWER SOURCE
TERMINAL SURFACE TREATMENTSOLDER
MEMORY DEVICE TYPEROM
TERMINAL TYPE AND QUANTITY16 FLAT LEADS
OVERALL WIDTH0.960 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN11 INPUT
INCLOSURE MATERIALCERAMIC
VERIFIED SUBSTITUTES & CROSS-REFERENCES 12
ROM/PROMInterchangeable
interchangeable cross-reference
interchangeable
6088926-4Interchangeable
interchangeable cross-reference
interchangeable
6133365-1Interchangeable
interchangeable cross-reference
interchangeable
6133365-2Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROM FAMILY 115Interchangeable
interchangeable cross-reference
interchangeable
6088926-3Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 3542372?
3542372 is a MICROCIRCUIT,MEMORY.
What parts can replace 3542372?
There are 12 known substitutes for 3542372: ROM/PROM, 6088926-4, 6133365-1 and 9 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 3542372?
3542372 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-075-6861. This indicates validated use in U.S. government and defense supply chains.
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✓ Validated with multiple authoritative sources, including Government, OEM, and Certified sources.
PartsTable Design LLC · partstable.com
Last verified: July 2026