ROM/PROM FAMILY 115 — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN, body_height: 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN, body_length: 0.400 INCHES MAXIMUM IN, overall_width: 0.745 INCHES MINIMUM AND 1.025 INCHES MAXIMUM IN, overall_height: 0.298 INCHES NOMINAL IN, overall_length: 0.840 INCHES MAXIMUM IN. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-075-6861, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

ROM/PROM FAMILY 115

NSN: 5962-01-075-6861
FSC: 5962
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)

SPECIFICATIONS

body_width	0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN
body_height	0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN
body_length	0.400 INCHES MAXIMUM IN
overall_width	0.745 INCHES MINIMUM AND 1.025 INCHES MAXIMUM IN
overall_height	0.298 INCHES NOMINAL IN
overall_length	0.840 INCHES MAXIMUM IN
features_provided	PROGRAMMABLE AND ELECTROSTATIC SENSITIVE AND MONOLITHIC
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC OR METAL
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
NSN	5962-01-075-6861

COMPONENT DIAGRAM

KEY FEATURES

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BODY HEIGHT: 0.085 INCHES MAXIMUM IN

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INCLOSURE CONFIGURATION: FLAT PACK

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BODY WIDTH: 0.275 INCHES MAXIMUM IN

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VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

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TERMINAL SURFACE TREATMENT: SOLDER

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MEMORY DEVICE TYPE: ROM

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TERMINAL TYPE AND QUANTITY: 16 FLAT LEADS

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

BODY HEIGHT	0.085 INCHES MAXIMUM IN
INCLOSURE CONFIGURATION	FLAT PACK
BODY WIDTH	0.275 INCHES MAXIMUM IN
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE
TERMINAL SURFACE TREATMENT	SOLDER
MEMORY DEVICE TYPE	ROM
TERMINAL TYPE AND QUANTITY	16 FLAT LEADS
OVERALL WIDTH	0.960 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN	11 INPUT
INCLOSURE MATERIAL	CERAMIC

VERIFIED SUBSTITUTES & CROSS-REFERENCES 12

ROM/PROMInterchangeable