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Technical Data Sheet
6133365-2 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.125 INCHES MAXIMUM IN, body_length: 0.840 INCHES MAXIMUM IN, overall_width: 0.310 INCHES MAXIMUM IN, overall_height: 0.298 INCHES NOMINAL IN, overall_length: 0.840 INCHES MAXIMUM IN. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-179-0529, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
6133365-2
NSN: 5962-01-179-0529
FSC: 5962
CAGE: 03640 — LOCKHEED MARTIN CORPORATION DIV ROTARY AND MISSION SYSTEMS (USA)
SPECIFICATIONS
body_width0.310 INCHES MAXIMUM IN
body_height0.125 INCHES MAXIMUM IN
body_length0.840 INCHES MAXIMUM IN
overall_width0.310 INCHES MAXIMUM IN
overall_height0.298 INCHES NOMINAL IN
overall_length0.840 INCHES MAXIMUM IN
features_providedBURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 155.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
NSN5962-01-179-0529
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 6133365-2 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
INPUT CIRCUIT PATTERN: 11 INPUT
BODY HEIGHT: 0.125 INCHES MAXIMUM IN
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.2 VOLTS NOMINAL POWER SOURCE
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
MEMORY DEVICE TYPE: ROM
TERMINAL SURFACE TREATMENT: SOLDER
FEATURES PROVIDED: BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
OVERALL WIDTH0.310 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN11 INPUT
BODY HEIGHT0.125 INCHES MAXIMUM IN
VOLTAGE RATING AND TYPE PER CHARACTERISTIC5.2 VOLTS NOMINAL POWER SOURCE
TERMINAL TYPE AND QUANTITY16 PRINTED CIRCUIT
MEMORY DEVICE TYPEROM
TERMINAL SURFACE TREATMENTSOLDER
FEATURES PROVIDEDBURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE
OVERALL LENGTH0.840 INCHES MAXIMUM IN
BODY WIDTH0.310 INCHES MAXIMUM IN
VERIFIED SUBSTITUTES & CROSS-REFERENCES 16
ROM/PROM FAMILY 115Interchangeable
interchangeable cross-reference
interchangeable
932610-501BInterchangeable
interchangeable cross-reference
interchangeable
S82S131WInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROMInterchangeable
interchangeable cross-reference
interchangeable
6088926-4Interchangeable
interchangeable cross-reference
interchangeable
6133365-1Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 6133365-2?
6133365-2 is a MICROCIRCUIT,MEMORY.
What parts can replace 6133365-2?
There are 16 known substitutes for 6133365-2: ROM/PROM FAMILY 115, 932610-501B, S82S131W and 13 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 6133365-2?
6133365-2 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-179-0529. This indicates validated use in U.S. government and defense supply chains.
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